Integrated Inductor with Magnetic Core in Semiconductor Flip-Chip Package
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current methods for integrating inductors in DC-DC converters face challenges in reducing parasitic inductances and achieving high-frequency compatibility, limiting the integration of magnetic materials with silicon processes and increasing component dimensions.
Innovation Solution
The integration of an inductor is achieved by forming two semiconductor bodies with a flip-chip technique, where one die houses the inductor circuitry and the other die includes a magnetic layer forming the magnetic core, allowing the inductor turns to envelop the core, reducing parasitic inductances and enabling high-frequency operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If magnetic material is completely integrated on the die using silicon processes, then integration density is improved, but the choice of magnetic materials is limited and manufacturing complexity increases
Solution Approach 1:
The device is divided into two separate semiconductor bodies: the first semiconductor body contains the circuitry formed by silicon processes, while the second semiconductor body contains the magnetic material layer. This segmentation allows each body to be optimized independently for its specific function, enabling the use of appropriate magnetic materials without compromising silicon process compatibility.
Solution Approach 2:
The second semiconductor body containing the magnetic material is integrated onto the first semiconductor body containing the circuitry, creating a nested structure. The magnetic material layer on the second body is positioned to be surrounded by the inductor turns formed on the first body, achieving high integration density while maintaining material compatibility.
2Area of moving object
If switching frequency is increased to reduce inductor dimensions, then integration is improved, but parasitic inductances increase and manufacturing difficulty increases
Solution Approach 1:
The magnetic material layer is strategically positioned in specific locations to provide magnetic shielding and flux confinement exactly where needed. This localized application of magnetic material reduces parasitic inductances in critical areas without requiring a complete redesign of the entire inductor structure, enabling high-frequency operation with compact dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces parasitic inductances, minimizes component dimensions, and enhances manufacturing efficiency by allowing independent processing of magnetic and silicon materials, resulting in a more compact and cost-effective DC-DC converter.
Implementation Method 1
a magnetic layer (30), extending within the insulation layer (26), wherein the second die (4) is coupled to the first die (2) with the flip-chip technique so that the portions of the inductor form, when coupled together, a complete inductor provided with a magnetic core set between the turns
Implementation Method 2
The first and second dice are coupled together via conductive contacts, in particular in the form of bumps (7) of metal material
Data Source
AI summary
An embodiment of an electronic device includes first and second semiconductor bodies. The first semiconductor body houses a first conductive strip having a first end portion and a second end portion, and houses a first conduction terminal electrically coupled to the first end portion and facing a surface of the first semiconductor body. The second semiconductor body houses a second conductive strip having a third end portion and a fourth end portion, and houses a second conduction terminal electrically coupled to the third end portion and facing a surface of the second semiconductor body. The first and second semiconductor bodies are arranged relative to one another so that the respective surfaces face one another, and the first conduction terminal and the second conduction terminal are coupled to one another by means of a conductive element so as to form a loop of an inductor.