Integrated Lamellae Extraction Station for Automated TEM Specimen Prep
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Solution Overview
Problem
Current semiconductor wafer testing processes, particularly in extracting lamellae less than 100 nm thick for S/TEM imaging, suffer from low throughput due to the need for human-controlled in situ extraction methods, which are time-consuming and costly, and ex situ methods are limited by equipment expense and complexity.
Innovation Solution
An integrated lamellae extraction station combining a nanomachining device and a lamellae plucker, with a wafer transfer device and computer-controlled processes, allows for automated and efficient creation, extraction, and transport of lamellae from wafers to S/TEM, reducing human intervention and equipment duplication.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If human-controlled in situ extraction methods are used, then extraction precision is maintained, but throughput is reduced and costs increase
Solution Approach 1:
The system enables automated self-service extraction where the computer control device automatically controls the FIB device and shaft device to complete lamellae extraction without human intervention. The system performs self-monitoring and self-adjustment during the extraction process, eliminating the need for continuous human oversight while maintaining extraction precision.
Solution Approach 2:
The patent replaces manual mechanical operations with automated computer-controlled mechanical systems. The computer control device substitutes human operators by automatically controlling the FIB device for material removal and the shaft device for lamellae retrieval, transforming a manually-controlled mechanical process into an automated one.
2Loss of time
If in situ extraction is performed, then equipment complexity is reduced, but time consumption increases
Solution Approach 1:
The extraction process is segmented into distinct functional modules: the FIB device for material removal, the shaft device for lamellae retrieval, and the computer control device for coordination. This segmentation allows each component to be optimized independently while working together in an integrated system, reducing overall extraction time without excessive complexity.
Solution Approach 2:
The shaft device serves multiple functions: it positions the lamellae during FIB machining, retrieves the extracted lamellae, and transports them to the collection substrate. This multi-functionality reduces the need for additional specialized equipment, balancing complexity reduction with time efficiency.
3Productivity
If ex situ methods are used, then throughput is improved, but equipment expense and complexity increase
Solution Approach 1:
The patent merges the FIB nanomachining device and the lamellae extraction device into a single integrated system. The computer control device coordinates both the FIB device for machining and the shaft device for extraction within one unified platform, eliminating the need for separate ex situ equipment while maintaining high throughput.
Solution Approach 2:
The shaft device acts as an intermediary between the FIB device and the collection substrate. It receives commands from the computer control device, positions itself during machining, retrieves lamellae after extraction, and delivers them to the substrate. This intermediary role enables seamless integration without requiring complex direct coupling between machining and extraction systems.
4Productivity
If automated control is implemented, then throughput increases, but initial system complexity increases
Solution Approach 1:
The computer control device implements feedback control by monitoring the extraction process and automatically adjusting parameters. The system receives status information from the FIB device and shaft device, processes this information, and sends corrective commands to maintain optimal extraction conditions, enabling automated operation with manageable complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly increases throughput by automating the lamellae extraction process, reducing personnel time, and lowering costs by integrating functions and eliminating redundant systems, thereby enhancing the efficiency and cost-effectiveness of semiconductor wafer testing.
Implementation Method 1
a focused ion beam (FIB) 14, which is used to remove wafer material, thereby defining lamellae
Implementation Method 2
A gas injection device 16 may be used in conjunction with FIB 14 or SEM 12, to deposit a selected material
Implementation Method 3
the lamella is attached to the fine shaft 22 by ion beam-induced deposition
Data Source
AI summary
An integrated station for extracting specimens suitable for viewing by a transmission electron microscope from a patterned semiconductor wafer, including a wafer cassette holder; a wafer transfer device; a nanomachining device, including a scanning electron microscope and a focused ion beam, a vacuum load lock and an operator control device, and wherein the operator control device notes locations of created lamellae; a plucker device; a control computer, adapted to control the wafer transfer device and the plucker device, commanding the plucker device to remover lamellae at the locations noted by the operator control device; and a user monitor and data input device, communicatively coupled to the computer. The wafer transfer device can transfer wafers from the wafer cassette holder to the vacuum load lock; from the vacuum load lock to the plucker device and from the plucker device to the wafer cassette holder.