Integrated Lamp-Driver Module for Miniaturized LED Display Packaging
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Solution Overview
Problem
The limited size of silicon-based CMOS wafers restricts the number of microchips that can be cut, leading to high microchip costs and hindering the integration and miniaturization of LED driver packages in display technology.
Innovation Solution
A light emitting module with an integrated lamp and driver is designed, featuring a substrate with a driving circuit layer, bonding electrodes, insulating layers, and a light emitting layer, where driving chips are arranged to drive the light emitting layer, and encapsulation layers are used to encapsulate the components without an additional substrate, reducing complexity and enabling miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If silicon-based CMOS wafers are used to drive microchips, then the microchips can be cut and used for driving, but the limited wafer size restricts the number of microchips that can be cut, leading to high costs
Solution Approach 1:
The patent combines the driving circuit layer with the light emitting layer on the same substrate, eliminating the need for separate microchips. The driving circuit is directly formed on the substrate using transparent conductive oxides and other materials, merging what were previously separate components into a single integrated structure. This increases the number of drivable pixels per substrate and reduces manufacturing costs by eliminating chip cutting and bonding processes.
Solution Approach 2:
The substrate serves multiple functions: it acts as both the mechanical support for the light emitting layer and as the base for integrating the driving circuit layer. The same substrate that supports the OLED structure also carries the driving circuitry, making it a multi-functional platform that eliminates the need for separate microchip substrates and reduces overall system complexity.
2Device complexity
If microchips and RGB LEDs are bonded to a passive drive wiring substrate, then electrical connection is realized, but the package cannot be integrated and miniaturized
Solution Approach 1:
The patent merges the driving circuit layer with the light emitting layer on the same substrate, eliminating the need for separate microchips. The driving circuit is directly formed on the substrate using transparent conductive oxides and other materials, merging what were previously separate components into a single integrated structure. This increases the number of drivable pixels per substrate and reduces manufacturing costs by eliminating chip cutting and bonding processes.
Solution Approach 2:
The patent transitions from a three-dimensional stacked architecture (separate chips bonded together) to a planar two-dimensional integration approach. The driving circuit and light emitting elements are arranged in layers on the same substrate plane, with conductive connections formed through the layers. This dimensional change enables higher integration density and smaller package size by utilizing the substrate surface area more efficiently.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution addresses the limitations of silicon-based CMOS by allowing more efficient use of microchips, reducing costs, and enhancing the integration and miniaturization of LED driver packages, thereby improving the integration and miniaturization of the light emitting module.
Implementation Method 1
a bonding electrode disposed on a side of the substrate away from the driving circuit layer, wherein the bonding electrode penetrates through the substrate and is electrically connected to a corresponding first electrode
Data Source
AI summary
A light emitting module with integrated lamp and driver includes a substrate, a driving circuit layer disposed on the substrate, a bonding electrode disposed on a side of the substrate away from the driving circuit layer, an insulating layer disposed on a side of the driving circuit layer away from the substrate, a second electrode disposed on a side of the insulating layer away from the substrate and electrically connected to the driving circuit layer, a light emitting layer electrically connected to a side of the second electrode away from the substrate, and a plurality of driving chips arranged in the driving circuit layer. The driving circuit layer includes at least one first electrode disposed on a side close to the substrate. The bonding electrode penetrates through the substrate and is electrically connected to a corresponding first electrode. The driving chips are configured to drive the light emitting layer.