Integrated LED Driver and Microcontroller for Automotive Lighting
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Solution Overview
Problem
Current LED driver production in automotive systems requires separate semiconductor technologies for bus transceivers and microcontrollers, leading to increased complexity, cost, and chip area, as well as reduced integration density due to the need for larger structure sizes in analog components.
Innovation Solution
Integrating data interface, microcontroller, and LED driver circuits on a common semiconductor substrate using semiconductor technology with a minimum structure size suitable for the analog components, allowing for reduced chip area and simplified assembly while maintaining functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate semiconductor technologies are used for bus transceivers and microcontrollers, then functionality is maintained, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent combines the bus transceiver (analog part) and microcontroller (digital part) into a single integrated circuit on one semiconductor chip. This merging eliminates the need for separate semiconductor technologies and multiple mounting steps, thereby reducing device complexity while maintaining all required functionalities through unified integration.
Solution Approach 2:
The integrated circuit serves multiple functions simultaneously: it acts as both a bus transceiver for data communication and a microcontroller for control operations. This multi-functionality is achieved by integrating different circuit blocks (analog and digital) within a single semiconductor device, eliminating the need for separate components.
2Reliability
If separate semiconductor technologies are used for bus transceivers and microcontrollers, then functionality is maintained, but manufacturing cost increases
Solution Approach 1:
By merging the bus transceiver and microcontroller into a single integrated circuit, the patent enables manufacturing in one fabrication process rather than requiring two separate semiconductor manufacturing processes. This single-step integration significantly reduces manufacturing cost while maintaining all functionalities.
Solution Approach 2:
The integrated circuit is segmented into functional blocks (analog block for bus transceiver, digital block for microcontroller) that can be designed and manufactured separately in terms of circuit architecture, but are physically integrated in a single semiconductor device. This segmentation approach allows optimized design while achieving cost-effective single-chip manufacturing.
3Extent of automation
If higher integration density semiconductor technology is used for microcontroller, then computing power is improved, but chip area increases due to analog component requirements
Solution Approach 1:
The patent applies local quality by using different structure sizes in different regions of the chip: high-density fine structures for the digital microcontroller block and larger analog structures for the bus transceiver block. This localized approach allows each part to be optimized for its specific function while sharing the same physical chip, thereby preventing overall chip area increase.
Solution Approach 2:
The patent resolves the area conflict by transitioning to a three-dimensional integration approach with multiple metal layers and vias, allowing dense routing and component placement. This vertical dimensionality enables high integration density without proportionally increasing the planar chip area, accommodating both analog and digital blocks efficiently.
Data Source
AI summary
The invention relates to a control device for a lighting or optical signaling apparatus or an optical measuring means in vehicles. The control device comprises a data bus interface, which can be a CAN bus data bus interface, a computer core (microcontroller) and a number nLED of a plurality of driver circuits, wherein nLED is a whole positive number greater than 1. Each driver circuit is designed to be able to supply at least one lamp group with electrical power. The nLED driver circuits are thus designed to be able to supply at least nLED lamp groups with electrical power. Each lamp group comprises one or more lamps, which can comprise one or more light-emitting diodes. The data bus interface and the computer core (microcontroller) and the nLED driver circuit are accommodated on a shared semiconductor substrate.


