Integrated LED Driver and Microcontroller for Automotive Lighting

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Solution Overview

Problem

Current LED driver production in automotive systems requires separate semiconductor technologies for bus transceivers and microcontrollers, leading to increased complexity, cost, and chip area, as well as reduced integration density due to the need for larger structure sizes in analog components.

Innovation Solution

Integrating data interface, microcontroller, and LED driver circuits on a common semiconductor substrate using semiconductor technology with a minimum structure size suitable for the analog components, allowing for reduced chip area and simplified assembly while maintaining functionality.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If separate semiconductor technologies are used for bus transceivers and microcontrollers, then functionality is maintained, but device complexity and manufacturing cost increase

Engineering Contradiction:
ImprovefunctionalityVSAvoidcomplexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines the bus transceiver (analog part) and microcontroller (digital part) into a single integrated circuit on one semiconductor chip. This merging eliminates the need for separate semiconductor technologies and multiple mounting steps, thereby reducing device complexity while maintaining all required functionalities through unified integration.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The integrated circuit serves multiple functions simultaneously: it acts as both a bus transceiver for data communication and a microcontroller for control operations. This multi-functionality is achieved by integrating different circuit blocks (analog and digital) within a single semiconductor device, eliminating the need for separate components.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If separate semiconductor technologies are used for bus transceivers and microcontrollers, then functionality is maintained, but manufacturing cost increases

Engineering Contradiction:
ImprovefunctionalityVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

By merging the bus transceiver and microcontroller into a single integrated circuit, the patent enables manufacturing in one fabrication process rather than requiring two separate semiconductor manufacturing processes. This single-step integration significantly reduces manufacturing cost while maintaining all functionalities.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The integrated circuit is segmented into functional blocks (analog block for bus transceiver, digital block for microcontroller) that can be designed and manufactured separately in terms of circuit architecture, but are physically integrated in a single semiconductor device. This segmentation approach allows optimized design while achieving cost-effective single-chip manufacturing.

Inventive Principle:
Principle #1Segmentation

3Extent of automation

If higher integration density semiconductor technology is used for microcontroller, then computing power is improved, but chip area increases due to analog component requirements

Engineering Contradiction:
Improvecomputing powerVSAvoidchip area
Core Design Contradiction:
Extent of automationVSArea of stationary object

Solution Approach 1:

The patent applies local quality by using different structure sizes in different regions of the chip: high-density fine structures for the digital microcontroller block and larger analog structures for the bus transceiver block. This localized approach allows each part to be optimized for its specific function while sharing the same physical chip, thereby preventing overall chip area increase.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent resolves the area conflict by transitioning to a three-dimensional integration approach with multiple metal layers and vias, allowing dense routing and component placement. This vertical dimensionality enables high integration density without proportionally increasing the planar chip area, accommodating both analog and digital blocks efficiently.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentEP4211989B1Compact control for lamps in a motor vehicle
Publication Date: 2024.12.18 ELMOS SEMICON AG
  • EP4211989B1 patent drawing
  • EP4211989B1 patent drawing
  • EP4211989B1 patent drawing

AI summary

The invention relates to a control device for a lighting or optical signaling apparatus or an optical measuring means in vehicles. The control device comprises a data bus interface, which can be a CAN bus data bus interface, a computer core (microcontroller) and a number nLED of a plurality of driver circuits, wherein nLED is a whole positive number greater than 1. Each driver circuit is designed to be able to supply at least one lamp group with electrical power. The nLED driver circuits are thus designed to be able to supply at least nLED lamp groups with electrical power. Each lamp group comprises one or more lamps, which can comprise one or more light-emitting diodes. The data bus interface and the computer core (microcontroller) and the nLED driver circuit are accommodated on a shared semiconductor substrate.