Integrated Chamber Lid Coating for Vacuum-Stable Plasma Etching
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Solution Overview
Problem
In semiconductor processing, there is a need for precise etching of layer structures with increasing aspect ratios and smaller features, which existing plasma etching technologies struggle to achieve due to thermal mismatch and mechanical stress between separate lid and gas delivery nozzle components, leading to vacuum seal issues and reduced longevity of processing chamber components.
Innovation Solution
A single composite structure integrating the lid and gas delivery nozzle from a dielectric material, with nanostructured ceramic-matrix coatings to enhance durability and reduce mechanical stress, allowing for precise gas distribution and improved vacuum sealing, and using additive manufacturing techniques for component formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If separate lid and gas delivery nozzle components are used, then ease of manufacture is improved, but thermal mismatch and mechanical stress increase leading to vacuum seal issues
Solution Approach 1:
The patent merges the lid and gas delivery nozzle into a single integrated component made from monolithic ceramic material. This integration eliminates the interface between separate parts, preventing thermal mismatch and mechanical stress that would compromise the vacuum seal, while maintaining manufacturability through ceramic forming and joining techniques.
Solution Approach 2:
The patent employs ceramic composite materials that combine the thermal stability and electrical insulation properties needed for both lid and gas delivery nozzle functions. The use of compatible ceramic materials ensures uniform thermal expansion and mechanical properties throughout the integrated structure, eliminating interface-related reliability issues.
2Ease of manufacture
If separate lid and gas delivery nozzle components are used, then ease of manufacture is improved, but component longevity decreases due to mechanical stress
Solution Approach 1:
By combining the lid and gas delivery nozzle into one monolithic component, the patent eliminates stress concentration at interfaces that would occur with separate parts. The integrated structure distributes mechanical and thermal stresses uniformly throughout the ceramic material, significantly extending component service life in the harsh plasma processing environment.
3Reliability
If integrated lid and gas delivery nozzle are used, then thermal mismatch and mechanical stress are reduced, but device complexity increases
Solution Approach 1:
The integration of lid and gas delivery nozzle functions into a single component actually simplifies the overall device architecture by eliminating the need for separate parts, mounting interfaces, and alignment mechanisms. While the internal geometry of the integrated component is complex, the assembly and maintenance complexity is reduced.
4Ease of manufacture
If conventional coating methods are used, then production costs are reduced, but manufacturing precision and coating durability decrease
Solution Approach 1:
The patent employs advanced coating techniques such as plasma spray or chemical vapor deposition that operate under controlled parameters to achieve precise, uniform, and durable coatings on the ceramic component. These methods provide better control over coating thickness, composition, and adhesion compared to conventional methods, ensuring consistent performance in plasma processing environments.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces thermal mismatch, enhances the longevity of processing chamber components, and improves the precision and efficiency of etching processes by minimizing mechanical stress and maintaining a secure vacuum seal, while allowing for complex geometries and reduced production costs.
Implementation Method 1
The chamber lid is formed from a dielectric material configured to allow RF energy generated by the plasma source to pass through the lid
Implementation Method 2
a plasma source configured to direct radio frequency ('RF') energy into the chamber body
Implementation Method 3
a nanostructured ceramic-matrix coating is described in which ceramic nanoparticles are combined with a polymer binder to form one or more layers. The coating can be used to help protect the integrated lid and chamber walls from the etch plasma
Data Source
AI summary
Semiconductor processing systems and system components are described. The system components include a chamber lid of a semiconductor processing chamber that includes a dielectric material having a substantially disk shape and integrating a lid portion and a gas delivery nozzle portion into a single structure. The chamber lid includes a plurality of gas flow paths that each traverse a region of the chamber lid from an input location at a first surface of the chamber lid to a respective output location on a different surface of the chamber lid and through which etch gases are distributed to particular portions of a processing region of the processing chamber.