Integrated Liquid Cooling Channels for High Power Density Electronics
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Solution Overview
Problem
Current liquid cooling solutions for high power density electronic components face challenges such as limited cooling capacity, reliability issues due to potential leaks in complex packaging environments, and the need for scalable, efficient, and cost-effective thermal management.
Innovation Solution
The design of liquid cooling devices with multiple integrated channels and optimized fluid distribution paths, including fin structures for enhanced heat transfer, allows for efficient cooling of high-density electronics by integrating fluid input and output ports with cooling channels and cold plates, enabling flexible and scalable thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid cooling is used to provide sufficient cooling capacity for high power density electronics, then cooling performance is improved, but reliability deteriorates due to potential leaks in complex packaging environments
Solution Approach 1:
The patent integrates the fluid distribution network directly into the liquid cooling device structure, merging the coolant delivery system with the cooling channels. This eliminates separate piping connections that are vulnerable to leaks, while maintaining effective liquid cooling for high power density electronics through the integrated cold plates and distributed channels
2Productivity
If multiple chips or boards are tightly packaged to yield very high power and heat densities, then productivity is improved, but device complexity increases due to limited space in complex packaging environment
Solution Approach 1:
The patent implements a nested structure where cold plates are positioned directly on multiple chips or boards, and the fluid distribution network is integrated within the liquid cooling device that encompasses all cold plates. This nested arrangement enables tight packaging of high power density components while managing the complexity through a hierarchical integration approach
3Temperature
If higher flow resistance of the fluid within the liquid cooling devices is used to enable better heat transfer coefficient, then cooling performance is improved, but use of energy increases due to larger operating power consumption
Solution Approach 1:
The patent employs localized fin structures at specific locations within the cooling channels where heat transfer requirements are highest. This targeted approach enhances the heat transfer coefficient only where needed, rather than increasing flow resistance system-wide, thereby minimizing the associated power consumption increase while achieving improved cooling performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances cooling performance, reliability, efficiency, and reduces costs by effectively managing heat in complex packaging environments, meeting the thermal needs of high-performance electronic components.
Implementation Method 1
liquid cooling devices with multiple integrated channels for cooling multiple electronic components with high power density
Implementation Method 2
design of liquid cooling devices with multiple integrated channels and optimized fluid distribution paths, including fin structures for enhanced heat transfer
Data Source
AI summary
Disclosed are liquid cooling devices for high power density electronics. The liquid cooling devices may include multiple integrated cooling channels for cooling the electronics in various configurations of the cooling channels and fluid distribution paths. A fluid input port and a fluid output port are connected to the supply and return loops of an external cooling source to distribute cooling liquid to the electronics and to return the liquid. The fluid input port may be connected to an inlet channel that distributes the cooling liquid to multiple inlets of the multiple integrated channels. The fluid output port may be connected to an outlet channel that provides a converging channel for the fluid existing from the multiple integrated channels. The multiple cooling fins and channels, inlet channel, outlet channel, fluid inlet port, and fluid outlet port may be integrated into multiple frames that are stacked to assemble the liquid cooling device.