Integrated Manifold Structure to Block Refrigerant-Coolant Heat Transfer
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Solution Overview
Problem
Existing manifolds in cooling and heating systems experience heat exchange between refrigerant and cooling liquid flow paths, leading to inefficiencies and potential improvements are needed to prevent such exchanges.
Innovation Solution
A manifold design with integrally molded first and second manifold portions and a coupling portion, where the cross-sectional area in the coupling portion is smaller than in each manifold portion, and includes gaps and slits to prevent heat transfer between refrigerant and cooling liquid flow paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the water-cooled condenser and the chiller are externally attached to the flow path housing with inlet and outlet ports close to each other, then the device complexity is reduced and ease of manufacture is improved, but heat exchange between the refrigerant and cooling liquid flow paths occurs which is harmful when heat exchange is to be prevented
Solution Approach 1:
The flow path housing is divided into a first flow path housing for the refrigerant and a second flow path housing for the cooling liquid, with the housings separated by a insulating member. This segmentation prevents heat exchange between the two flow paths while maintaining the benefit of integrated manufacturing.
Solution Approach 2:
An insulating member is introduced as an intermediary between the first and second flow path housings. This insulating member blocks heat transfer between the refrigerant and cooling liquid flow paths while allowing the housings to remain closely positioned for compact design.
2Volume of moving object
If the first manifold portion and the second manifold portion are positioned close to each other for compact integration, then the volume is reduced, but heat exchange between the refrigerant and cooling liquid flow paths occurs
Solution Approach 1:
The manifold is segmented into a first manifold portion for refrigerant and a second manifold portion for cooling liquid, with each portion housed in separate flow path housings. This segmentation allows compact positioning while preventing heat exchange through the insulating member between housings.
Solution Approach 2:
The insulating member acts as a thermal barrier between the closely positioned first and second flow path housings, enabling compact integration of the manifold while preventing harmful heat exchange between the refrigerant and cooling liquid flow paths.
3Device complexity
If a single integrated flow path housing is used for both refrigerant and cooling liquid, then the device complexity is reduced, but heat exchange occurs between the flow paths which reduces system efficiency
Solution Approach 1:
The integrated flow path housing is segmented into separate first and second housings for refrigerant and cooling liquid respectively, with thermal insulation between them. This maintains the simplicity of an integrated design while preventing energy loss through heat exchange.
Solution Approach 2:
The insulating member serves as a thermal intermediary that blocks heat transfer between the refrigerant and cooling liquid flow paths, preventing energy loss while maintaining the compact integrated structure of the manifold.
Data Source
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AI summary
A manifold (1) includes: a first manifold portion (10) including a refrigerant flow path (10A) through which a refrigerant flows; a second manifold portion (20) including a cooling liquid flow path (20A) through which a cooling liquid flows; and a coupling portion (30) configured to couple the first manifold portion and the second manifold portion to each other. The first manifold portion, the second manifold portion, and the coupling portion are integrally molded into an integrally molded product. A cross-sectional area of a surface orthogonal to a first direction (X) in which the first manifold portion and the second manifold portion face each other in the coupling portion is smaller than a cross-sectional area of a surface orthogonal to the first direction in each of the first manifold portion and the second manifold portion.