Integrated MEMS Modules on LGA Substrate
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Solution Overview
Problem
Conventional MEMS devices face limitations in performance, size reduction, cost, and computational power, requiring more complex microsystems that do not currently exist, and often suffer from issues like stiction and noise, which affect their reliability and accuracy.
Innovation Solution
The integration of two or more MEMS modules, such as accelerometers and gyroscopes, with CMOS logic on a land grid array substrate, bonded together with additional control logic and encapsulation, allows for improved data sensing and output processing, addressing stiction issues and enhancing data reliability and noise reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional MEMS devices are used, then manufacturing is simpler, but performance and computational power are limited
Solution Approach 1:
The patent combines multiple MEMS devices (accelerometers, gyroscopes, magnetometers) with CMOS control logic and processors into a single integrated module. This merging allows the system to achieve enhanced performance and computational power while maintaining manufacturing simplicity through established CMOS fabrication processes.
Solution Approach 2:
The integrated MEMS module incorporates multiple sensing functions (acceleration, rotation, magnetic field detection) and computational capabilities within a single device. This multi-functionality enables the system to perform complex environmental sensing and processing tasks that conventional single-function MEMS devices cannot achieve.
2Extent of automation
If MEMS devices are integrated with control logic and processors, then computational power increases, but device complexity increases
Solution Approach 1:
The patent integrates MEMS sensing elements, CMOS control logic, and processing units into a single unified module. This consolidation increases computational power while managing complexity by organizing components in a hierarchical structure where simpler components work together to achieve complex functions.
Solution Approach 2:
The integrated module includes on-chip processing capabilities that allow the MEMS devices to perform data processing and decision-making functions autonomously. This self-service approach reduces the need for external processing, thereby increasing computational power while containing system complexity within the module.
3Reliability
If multiple MEMS modules are bonded to LGA substrate, then data reliability improves, but manufacturing complexity increases
Solution Approach 1:
The patent bonds multiple MEMS modules (accelerometers, gyroscopes, magnetometers) to a common LGA substrate, creating an integrated sensing system. This merging improves data reliability through sensor fusion and cross-validation, while managing manufacturing complexity by using standardized bonding processes and modular design.
Solution Approach 2:
The system is divided into separate functional modules (accelerometer module, gyroscope module, magnetometer module) that are independently fabricated and then bonded to the LGA substrate. This segmentation allows each module to be optimized independently while maintaining overall system reliability, and simplifies manufacturing by enabling modular assembly.
4Volume of moving object
If MEMS devices are made smaller, then device size reduces, but performance and accuracy deteriorate
Solution Approach 1:
The patent combines multiple MEMS sensing elements into a compact integrated module on an LGA substrate. This merging allows the system to maintain small form factor while achieving high accuracy through sensor fusion and computational processing that compensates for individual sensor limitations.
Solution Approach 2:
The system uses computational processing to change the effective parameters of the sensing system. By processing data from multiple sensors and applying algorithms, the system achieves measurement precision that exceeds what would be possible with a single small MEMS device, thereby decoupling size reduction from accuracy deterioration.
Data Source
AI summary
A method for operating an electronic device comprising a first and second MEMS device and a semiconductor substrate disposed upon a mounting substrate includes subjecting the first MEMS device and the second MEMS device to physical perturbations, wherein the physical perturbations comprise first physical perturbations associated with the first MEMS device and second physical perturbations associated with the second MEMS device, wherein the first physical perturbations and the second physical perturbations are substantially contemporaneous, determining in a plurality of CMOS circuitry formed within the one or more semiconductor substrates, first physical perturbation data from the first MEMS device in response to the first physical perturbations and second physical perturbation data from the second MEMS device in response to the second physical perturbations, determining output data in response to the first physical perturbation data and to the second physical perturbation data, and outputting the output data.