Acceleration Measurement Using Interia Forces TRIZ Cases

Segmenting the spring mass system reduces fabrication costs while maintaining reliability through modular assembly.

A head form missile equipped with high-g and low-g accelerometers measures deceleration forces during free-fall.

Forming resonators vertically over CMOS circuitry eliminates alignment issues and reduces fabrication costs while improving signal-to-noise ratios.

Dynamic switching of capacitive sensor outputs rejects common-mode electromagnetic interference without bulky shielding, improving robustness by up to 40 dB.

A MEMS inertial sensor uses flexible protrusions to absorb impact energy and prevent short circuits during excessive swinging.

Asymmetrical detection masses rotate on torsion beams to vary electrode overlap area and double capacitance sensitivity.

Movable part rotates about a rotation axis to detect inertial forces via capacitance changes between symmetric electrodes.

Segmented elastic elements eliminate channel crosstalk and temperature effects, enabling accurate force measurements across various footprint sizes.

An impact detection system uses an accelerometer and Fast Fourier Transform to estimate impact location and magnitude for vehicle safety.

Neural networks analyze acceleration data to distinguish vehicle strikes from normal loads, preventing undetected structural damage.

Adjust acceleration sensors using existing electrodes to deflect the seismic mass via electrostatic interaction.

Protrusion elements segment elongated beams to boost torsional stiffness, resolving the trade-off between compact device size and sufficient restoring force.

A combination sensor module with independent submodules enables flexible vehicle sensing configurations.

Inject test signals into sensor-conditioning preamplifiers to characterize impedance and resonance without additional cabling.

A calibration method detects a substantially invariant axis of rotation from three-axis sensor measurements to simplify motion estimation.

Varying electrode thickness resolves MEMS sensor direction discrimination while counterweight symmetry prevents torsion distortion.

A two-wire reference accelerometer performs self-calibration using gravity-induced bias measurements.

Adjustable position accelerometer systems calculate direction-tuned vectors from arbitrary mounting axes using preliminary calibration maneuvers.

A method estimates initial orientation and velocity using soft constraints on expected motion patterns.

Conductive plugs bridge separated substrates to enable monolithic integration, reducing fabrication complexity and device size.

A physical quantity measuring device calculates difference vectors to statistically estimate offsets for portable sensors.

A MEMS inertial sensor uses weakly coupled resonant elements to detect vibration amplitude variations for precise force measurement.

Segmenting fabrication stages below 450°C protects CMOS circuits while island attachments boost inertial sensor sensitivity.

Time-division multiplexing routes data from multiple inertial measurement units through a single port, resolving communication port shortages and noise issues.

An asymmetric fulcrum and electrode arrangement in a closed-loop MEMS accelerometer prevents spurious vibration modes triggered by feedback forces.

A lead group supports a printed substrate in an inertial measurement unit to reduce mechanical stress on the sensor.

High elastic modulus interposer suppresses axis deviation under temperature fluctuations, maintaining detection accuracy reliability.

Replacing thermal joining with elastic mechanical force, this design eliminates soldering costs and noise while ensuring reliable electrical connection.

A moving element inertial sensor uses a covered electrode on a protrusion to prevent sticking.

Segmenting connections into multiple cantilever beams distributes stress and prevents cracking, enhancing reliability without sacrificing sensitivity.

A single inertial sensor partitions time series data into movement periods and classifies them to determine performance indicators.

A sensing device combines force and acceleration sensors with a processor to determine their relationship.

A resonant accelerometer uses a stress decoupling anchor and electrostatic tuning to enhance sensitivity.

A wearable watch calculates jump height using embedded pressure and acceleration sensors to detect motion spikes.

Decoupling springs separate in-plane movements from out-of-plane displacements, protecting strain gauges from irreversible deformations.

A MEMS accelerometer structure uses polarity anti-symmetric sensing element patterns to detect motion normal to the reference plane.

A processing system generates motion models from inertial sensor signals to estimate user speed and position.

A control unit detects free fall in a rotation rate sensor and deactivates the driving force to halt seismic mass oscillation.

A micromechanical sensor device stacks unhoused sensor units vertically to enable flexible wiring and hermetic sealing.

A sensor data processing module determines ground and vertical planes to calculate pitch and roll alignment values for an inertial measurement unit.

Variable vertical gaps between the pivoting beam and substrate increase sensitivity while preventing stiction at high frequencies.

A compact opto-electronic sensor uses an inverted light source mounted on a structure to emit light through an opening onto a position-sensitive device.

Integrating capacitive and piezo sensing elements on a single inertial mass reduces device footprint while maintaining full three-axis detection capability.

Bonding multiple MEMS sensors to an LGA substrate reduces noise and stiction while increasing computational power.

Central mass block drives ring-shaped piezoelectric element via torque, reducing volume and cost while maintaining power generation.

Protrusions on oscillating members prevent damage during high acceleration events while simplifying manufacturing by merging stoppers with proof masses.

A MEMS wafer stack uses insulated conducting channels to route electrical signals without through-silicon vias.