Spring-Loaded Sensor Lead Eliminates Soldering

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Solution Overview

Problem

Conventional sensors require soldering for joining the metal lid and package, which increases costs and complicates the sealing and grounding processes, while also introducing potential noise components into the sensor signals.

Innovation Solution

A sensor design that uses a lead with a spring function, where the lead is electrically connected to both the lid and the grounding electrode, eliminating the need for soldering and providing a reliable seal without the use of adhesives, and incorporates a detection circuit to reduce noise through correlated double sampling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If soldering is used for joining the metal lid and package, then reliable electrical connection and sealing are achieved, but manufacturing cost increases and process complexity increases

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent replaces the soldering process (thermal/mechanical system) with a spring-loaded lead structure that uses elastic mechanical force to achieve both electrical connection and sealing. The lead with spring function provides continuous contact pressure between the lid and package, eliminating the need for soldering while maintaining reliable electrical connection and hermetic sealing.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Reliability

If soldering is used for joining the metal lid and package, then reliable electrical connection is achieved, but device complexity increases

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidassembly process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent replaces the complex soldering process with a simple spring-loaded lead insertion mechanism. The lead's spring function automatically provides contact pressure and maintains electrical connection without requiring external heating equipment, flux, or complex alignment procedures, thereby reducing assembly process complexity.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The lead with spring function is self-adjusting and self-maintaining. The spring automatically compensates for thermal expansion, mechanical stress, and positioning tolerances, providing continuous reliable contact without requiring external intervention or complex control systems.

Inventive Principle:

Principle #25Self-service

3Reliability

If soldering is used for joining, then electrical connection is achieved, but noise components are introduced into sensor signals

Engineering Contradiction:

Improveelectrical connectionVSAvoidnoise in sensor signals

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent replaces soldering with a spring-loaded lead structure that establishes electrical contact through pure mechanical pressure without thermal input. This eliminates the thermal noise and electromagnetic interference associated with soldering processes, providing cleaner sensor signals while maintaining reliable electrical connection.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution reduces the complexity and cost of sensor assembly, enhances signal integrity by eliminating noise, and improves the accuracy of acceleration detection across multiple axes.

Implementation Method 1

The lead includes first and second portions. The first portion of the lead is electrically connected to the grounding electrode and extends along a side surface of the package with a gap provided between the first portion and the side surface. The second portion of the lead is disposed between the lid and the package and extends toward the inside of the package.

Methodology Applied

Scientific EffectElasticity: Elasticity

Data Source

PatentUS10534013B2Sensor

Publication Date: 2020.01.14 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD

AI summary

A sensor includes a sensor element, a package accommodating the sensor element in an inside of the package, a grounding electrode disposed in the package, a lid covering an opening of the package, and a lead extending from the package. The lead includes first and second portions. The first portion of the lead is electrically connected to the grounding electrode and extends along a side surface of the package with a gap provided between the first portion and the side surface. The second portion of the lead is disposed between the lid and the package and extends toward the inside of the package. In this sensor, the opening can be sealed without soldering and reliably connect the lid to the grounding electrode.