Vertically Stacked MEMS Sensor with Integrated ASIC
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Solution Overview
Problem
Existing micromechanical sensor devices require multiple chips and complex packaging, leading to increased size, cost, and complexity, especially when integrating magnetic sensors, which hinders high integration density and efficient data processing.
Innovation Solution
A micromechanical sensor device with a bare-die design featuring vertically integrated MEMS and ASIC units connected via solder bumps, allowing for a larger footprint unit to cover a smaller one, enabling flexible wiring and hermetic sealing while reducing packaging needs, and incorporating additional sensors like magnetic or microcontroller units for enhanced functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple separate sensor chips are used for different measured variables, then functional versatility is improved, but device complexity and packaging requirements increase
Solution Approach 1:
The patent combines multiple sensor chips (acceleration sensor, rotational speed sensor, magnetic field sensor) into a single integrated sensor device with a unified housing. This merging approach maintains the functional versatility of detecting multiple physical quantities while eliminating the need for separate packaging of individual sensor modules, thus reducing overall device complexity and packaging requirements.
Solution Approach 2:
The sensor device is designed as a universal platform that can simultaneously perform multiple sensing functions (acceleration, rotational speed, magnetic field detection) through integrated sensor chips. This multi-functional design allows a single device to replace multiple separate sensor modules, improving versatility while reducing packaging complexity.
2Reliability
If plastic packaging is used for sensor modules, then protection and housing are improved, but footprint and space requirement increase
Solution Approach 1:
The patent employs a single unified housing that encapsulates multiple sensor chips (acceleration sensor, rotational speed sensor, and magnetic field sensor) together with their respective electronic components. This consolidated packaging approach provides comprehensive protection for all sensors while significantly reducing the overall footprint compared to separate plastic-packaged sensor modules.
3Productivity
If magnetic or magnetoresistive layers are applied directly on CMOS-ASIC, then integration density is improved, but production complexity and costs increase
Solution Approach 1:
The patent segments the magnetic field sensor into a separate dedicated chip rather than integrating it directly onto the CMOS-ASIC. This segmentation approach maintains high integration density by consolidating all sensors in one device while simplifying production by allowing each sensor type to be manufactured and tested independently before final assembly, thereby reducing production complexity and costs.
4Extent of automation
If additional microcontroller functionalities are integrated into sensor ASIC, then data pre-processing capability is improved, but device complexity increases
Solution Approach 1:
The patent integrates microcontroller functionalities directly into the sensor ASIC chip, merging the data acquisition and pre-processing capabilities into a single unified component. This integration enhances automation by enabling intelligent data processing (such as calculating quaternions) at the sensor level while reducing overall device complexity by eliminating the need for separate microcontroller hardware and associated interconnections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves a high degree of integration with reduced space and cost, enabling efficient electrical contacting and signal processing, while allowing for various sensor configurations like 6D, 9D, or more, with improved integration density and reduced production complexity.
Implementation Method 1
For the magnetic sensor mechanism, various physical principles and measurement methods are used, such as resistive measurements of magnetoresistive layers (AMR, GMR), measurements of the inductance in soft-magnetic materials (flux gate or flip core design), or exploitation of the Hall effect.
Data Source
AI summary
A micromechanical sensor device, having a first unhoused sensor unit, and at least one second unhoused sensor unit, the sensor units being functionally connected to one another, the sensor units being essentially vertically configured one over the other so that a sensor unit having a larger footprint completely covers a sensor unit having a smaller footprint.