Integrated Mother Substrate for Slim LED Displays
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Solution Overview
Problem
Existing LED display devices have a thick backlight unit that hinders their slimness and miniaturization, and current manufacturing processes are complex and costly due to the need for additional light guide plates and bonding processes.
Innovation Solution
The use of a mother substrate for light-emitting units that serves as both the light guide plate and the base for epitaxially grown LEDs, eliminating the need for additional light guide plates and simplifying the manufacturing process by integrating LEDs directly onto the substrate, which can be made of materials like sapphire or SiC, and using a patterned layer to enhance light uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If a traditional LED backlight unit structure is used with separate light guide plates and bonding processes, then the manufacturing process is established and reliable, but the thickness of the display device becomes too great
Solution Approach 1:
The patent merges the light guide plate function and LED mounting substrate into a single integrated mother substrate. The mother substrate simultaneously serves as the structural base for epitaxially grown LEDs and the light guiding component, eliminating the need for separate light guide plates and reducing overall device thickness while simplifying manufacturing steps.
Solution Approach 2:
The mother substrate performs multiple functions: it acts as the substrate for epitaxial growth of light-emitting units, serves as the mounting base for LEDs, and functions as the light guide plate. This multi-functionality reduces the number of components needed and decreases device thickness without compromising manufacturing reliability.
2Ease of manufacture
If additional light guide plates and bonding processes are used, then light guiding function is achieved, but manufacturing cost and process complexity increase
Solution Approach 1:
The patent combines multiple components (substrate and light guide plate) into a single integrated mother substrate, reducing the quantity of separate components from two or more to one. This integration simplifies the manufacturing process by eliminating bonding steps between separate light guide plates and LED substrates, directly addressing the contradiction between manufacturing simplicity and component quantity.
3Ease of operation
If LEDs are mounted on a separate substrate and then bonded to the light guide plate, then assembly is straightforward, but the overall thickness increases
Solution Approach 1:
The patent integrates the LED substrate and light guide plate into a single mother substrate structure, eliminating the need for separate assembly and bonding steps. LEDs are grown directly on the mother substrate which simultaneously serves as the light guide, thereby reducing backlight unit thickness while maintaining assembly simplicity through epitaxial growth processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the overall thickness of the display device, simplifies manufacturing, and improves light-guiding and light uniformity, enabling more compact and efficient LED display devices.
Implementation Method 1
serves as a light guide plate
Implementation Method 2
using a patterned layer to enhance light uniformity
Data Source
AI summary
A display device is provided. The display device includes a mother substrate for light-emitting units. The mother substrate for light-emitting units has a first upper surface and a first lower surface. The display device also includes at least one light-emitting unit disposed on the first lower surface, and a first substrate having a second upper surface, a second lower surface, and a plurality of active devices disposed between the second upper surface and the second lower surface. The light-emitting unit is electrically connected with at least one of the active devices of the first substrate.