Integrated Optical Chip Module for Mouse Assembly
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The assembly time for conventional optical mice is lengthy due to the need for accurate positioning and adjustment of LEDs and sensors on the circuit board, leading to increased manufacturing and production costs.
Innovation Solution
A chip module package structure integrating a cover body with a first chip module for the optical source and a second chip module for the optical sensor, allowing for simultaneous assembly and reducing the need for precise alignment, enabling quicker assembly and cost-effective production by allowing individual module replacement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If LED and sensor are respectively disposed on circuit board with accurate position adjustment, then optical path alignment is achieved, but assembly time is excessively long
Solution Approach 1:
The patent combines the LED and sensor into a single integrated chip module package structure. The LED chip and sensor chip are mounted on the same substrate with predetermined positions, and the entire module is installed as one unit on the circuit board. This merging eliminates the need for separate positioning and adjustment of individual components, thereby reducing assembly time while maintaining optical path alignment precision.
2Ease of repair
If LED and sensor are separately assembled on circuit board, then individual component replacement is possible, but overall assembly complexity increases
Solution Approach 1:
The patent segments the optical system into a distinct chip module package that can be independently replaced. While the LED and sensor are integrated within the module, the entire module functions as a replaceable unit on the circuit board. This segmentation provides ease of repair at the module level while avoiding the complexity of assembling and aligning multiple individual components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Simplifies the assembly process of optical input devices by integrating the optical source and sensor modules on a cover body, reducing assembly time and manufacturing costs by allowing for single-module replacement when damaged.
Implementation Method 1
an optical source irradiates a surface, a beam reflected back is picked up within a certain period of time
Implementation Method 2
a beam reflected back is picked up within a certain period of time, and by means of rapid scan and pickup, a moving direction and a moving distance of the optical mouse are calculated through comparison
Data Source
AI summary
A chip module package structure applied to an optical input device includes a cover body, a first chip module, and a second chip module. The first chip module and the second chip module are respectively combined with the cover body, the first chip module has an optical source, and the second chip module has an optical sensor. Further, the optical source and the optical sensor form a preset relative spatial position relation, such that a part of light emitted by the optical source is received by the optical sensor after at least one reflection.