Integrated Optical Inspection System for VCSEL Brightness and M2 Testing
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Solution Overview
Problem
Traditional optical inspection systems for devices like VCSEL chips require separate stations for brightness and M2 (beam quality factor) inspections, leading to increased system volume, reduced space efficiency, and longer test device movement distances and times.
Innovation Solution
An integrated optical inspection system that combines near field and M2 optical inspections in a single module, using a first displacement device for rough adjustments and a second for fine adjustments, allowing sequential inspections without additional device movement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If separate inspection stations are used for brightness and M2 inspections, then inspection accuracy is maintained, but system volume increases and space efficiency decreases
Solution Approach 1:
The patent combines the brightness inspection module and M2 inspection module into a single integrated inspection system. The brightness inspection unit and beam quality factor inspection unit share common components including the optical path, displacement devices, and control system, thereby reducing overall system volume while maintaining the measurement precision of both inspection functions.
Solution Approach 2:
The inspection system is designed with multi-functionality where a single system performs both brightness inspection and M2 (beam quality factor) inspection. The displacement devices and optical components serve dual purposes for both inspection types, eliminating the need for separate dedicated stations and improving space efficiency.
2Adaptability or versatility
If separate inspection stations are used for brightness and M2 inspections, then functional independence is maintained, but device movement distance and inspection time increase
Solution Approach 1:
Both brightness and M2 inspections are performed at the same inspection station without requiring the inspected object to be moved between separate stations. The integrated design allows sequential or simultaneous execution of both inspection functions, significantly reducing the time lost in transporting the device between stations while preserving the functional independence of each inspection mode.
3Measurement precision
If multiple displacement devices are used for rough and fine adjustments, then positioning precision is improved, but device complexity increases
Solution Approach 1:
The displacement system is segmented into two functional levels: a first displacement device for rough adjustment providing large-range positioning, and a second displacement device for fine adjustment providing high-precision positioning. This segmentation allows each device to be optimized for its specific function, achieving high overall positioning precision while managing complexity through functional division.
Solution Approach 2:
The system employs dynamic displacement mechanisms where the first and second displacement devices can be activated sequentially or in combination based on the inspection requirements. The displacement devices enable dynamic adjustment of the optical inspection device position along the optical axis, providing both large-range and fine-positioning capabilities without requiring a permanently complex mechanical structure.
Data Source
AI summary
An optical inspection system includes a brightness inspection module for inspecting the brightness of a light emitting element, an integrated inspection module for inspecting the near field optical characteristic and the beam quality factor of the light emitting element, and a far field inspection module for inspecting the far field optical characteristic of the light emitting element. As a result, the optical inspection system is space-saving and capable of reducing the distance and time of the movement of the device under test.