Optically Investigating Flaws/Contamination TRIZ Cases

Calibration method separates incoming and outgoing optical system properties using multiple diffraction order measurements.

Multimodal optical imaging segments detection into transmitted, reflected, and dark field paths to resolve low contrast in scattering liquids.

Shifting among multiple crystal sites minimizes re-calibration time caused by beam parameter changes during degradation.

Sequential pulsed illumination reduces light interference and installation space while maintaining high detection accuracy for glass bottle flaws.

A 3D scanner adjusts laser power via photodiode feedback to maintain sensor dynamic range.

A box lock-in electronic circuit discriminates defect signals from noise using notch filters at modulation frequencies.

Dynamic focal point adjustment optimizes detection sensitivity across varying semiconductor wafer surface heights.

A detection system dynamically updates second harmonic peaks to adjust thresholds for real-time background interference elimination.

Dynamic trajectory following irregular edge profile minimizes light banding and improves defect detection sensitivity.

A dispensing apparatus detects foreign matter in microplate wells using a light emitter and receiver to measure scattered light signals.

Replacing ambient air with helium reduces background Rayleigh scattering, enabling detection of 25 nm defects without full chamber atmosphere replacement.

A defect classification device uses two-stage threshold values to differentiate pre- and post-inspection signals for accurate on-film defect identification.

A terahertz radiation system scans extruded products using parallel rays to determine dimensional parameters.

Heat treatment and spectrocolorimetric analysis of crystalline succinic acid quantify thermal stability via yellow index measurement.

A radiation inspection system uses dual-wavelength beams to detect surface pits on semiconductor substrates.

Deep learning analysis of acquired images detects elastane-free, damaged, abrasion, color, and diameter faults to replace inefficient manual visual inspection.

A mesa height map corrects focal position deviations to maintain optical image clarity during semiconductor inspection.

Self-contained inertial sensors generate position data to detect rail deviations as small as 1/64 inch without external signals.

This semiconductor measurement device captures azimuthal dependence via a matrix detection unit, eliminating sample rotation to boost throughput without sacrificing precision.

A measurement system splits radiation into components and applies independent modulation to each for simultaneous multi-wavelength target illumination.

Machine learning models analyze captured images of sealing bands to detect defects, eliminating operator dependency and ensuring sterility.

Back focal plane microscopy uses pinhole masking and angular resolution to characterize isolated features via scattering matrices.

A measurement apparatus divides inspection into simultaneous and sequential light emission phases to identify abnormal regions on objects.

A dual-stage spectrum matching method filters noise from light spot deviations to determine structural parameters accurately.

A processor adjusts light intensity to match target gray values for a correction object, generating a mapping table for image capture.

Color imaging separates RGB channels to resolve edge bead removal line orientation, overcoming grayscale intensity limitations.

Spatial light modulator replaces discrete LED zones with programmable masks, resolving lighting compensation limits for non-uniform opacity objects.

Signed difference image analysis filters non-repeater noise to increase repeater capture rates.

Segmented adsorption chuck holds semiconductor wafers while allowing beam transmission through gaps between holding portions.

Synchronized multi-zone imaging captures comprehensive vehicle data in one pass, eliminating sequential scanning delays and reducing inspection time.

Automated defect detection system uses Robust PCA and classifier to filter non-defect images, resolving inspection time loss while maintaining high reliability.

Segmented magnetic coils enable simultaneous axial and radial inspection, eliminating cycle delays from moving parts.

Modular machine vision detects bottle defects to resolve accuracy complexity tradeoffs in automated quality control lines.

Radiation device irradiates container treatment areas to make non-functional media visible through optical reactions.

Segmented camera array and processing unit eliminate parallax errors to ensure accurate flat slab identification.

A wafer model selection method determines coefficients for multiple models approximating critical dimension values as functions of position coordinates.

A semiconductor wafer inspection method calculates the ratio of in-plane standard deviation to average haze signal for non-defective classification.

Segmenting interferometry into discrete capture events reduces computational complexity while maintaining measurement accuracy on vibrating wafers.

Segmenting imaging modes into dark-field confocal and vortex dichroism captures both geometrical defects and chirality information without information loss.

Top-mounted light guide illuminates container sides, resolving interference between side and top scanning.

Light field cameras capture 3D surface information to detect defects, resolving mechanical anomalies like flutter and cockle in high-speed production.

An integrated optical inspection system combines near field and beam quality factor measurements in a single module using shared displacement devices.

A terahertz inspection device uses a vibrating guide wire to direct electromagnetic waves for sample analysis.

A spatial filter surface width calculation maximizes the signal-to-noise ratio in semiconductor inspection systems.

A mobile inspection tunnel uses elastically bent LED support sheets to illuminate reflective surfaces within a double-walled modular structure.

Standardizing spectral values per wavelength enables sensitive foreign substance detection in tablet inspection.

Transient continuous wave electromagnetic radiation detects layer interfaces and material properties in multilayer structures.

A device measures complex impedance and infrared absorption to identify liquid contents within opaque containers.

Camera system splits collimated beams to measure target offsets, replacing manual alignment with autonomous precision.