Wafer Measurement Chuck with Segmented Adsorption for Beam Interference Reduction
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Solution Overview
Problem
Current nondestructive examination methods for semiconductor wafers fail to precisely detect defects due to interference issues, leading to unreliable electrical characteristic measurements.
Innovation Solution
A wafer examination apparatus with a chuck and adsorption portions that minimize beam interference, combined with a beam transmission method and inpainting/image processing techniques to create accurate measurements, and a method utilizing wafer rotation for enhanced defect detection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a traditional chuck is used to hold the wafer, then the wafer can be securely positioned, but the chuck interferes with the beam transmission and reduces measurement reliability
Solution Approach 1:
The chuck is divided into multiple segments or adsorption portions that can be individually positioned. This segmentation allows the beam to pass through gaps between the segments, reducing beam interference while maintaining wafer holding capability through coordinated adsorption at multiple points.
Solution Approach 2:
The chuck structure is designed with asymmetric adsorption portions positioned strategically to minimize beam obstruction. By placing adsorption portions only where necessary for wafer securing and leaving other areas open, the design reduces harmful beam interference while maintaining adequate wafer positioning.
2Measurement precision
If electrical characteristic measurement methods are used for nondestructive examination, then electrical performance can be assessed, but defective portions cannot be detected precisely due to performance deterioration
Solution Approach 1:
A beam (such as X-ray or other penetrating radiation) is introduced as an intermediary measurement tool that can pass through the wafer and adsorption portions without being significantly affected by them. This beam-based measurement method provides precise defect detection capability while maintaining examination reliability, as the beam can detect internal defects without requiring electrical contact or being influenced by electrical performance deterioration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus and method enhance the reliability of wafer measurements by minimizing beam interference and accurately detecting defects, ensuring precise examination of semiconductor wafers without damaging them.
Implementation Method 1
a beam irradiator connected to the support bar and disposed between the plate and the horizontal frame. The beam irradiator may be configured to irradiate a beam on the wafer
Implementation Method 2
a detector on an opposite side of the horizontal frame from the beam irradiator and configured to receive the beam after it has penetrated through the wafer
Implementation Method 3
first to third adsorption portions connected with the horizontal frame and configured to adsorb the wafer
Data Source
AI summary
Provided is an apparatus for measuring a wafer. The apparatus may include a chuck disposed on a stage and a plate connected with the stage, a horizontal frame configured to support a wafer, and a vertical frame connecting the plate and the horizontal frame. The apparatus may further include first to third adsorption portions connected with the horizontal frame and configured to adsorb the wafer, a support bar penetrating through the chuck and extending in a first direction and a beam irradiator connected to the support bar and disposed between the plate and the horizontal frame. The beam irradiator may be configured to irradiate a beam on the wafer. The apparatus may further include a detector on an opposite side of the horizontal frame from the beam irradiator and configured to receive the beam after it has penetrated through the wafer.