Terahertz Inspection Device with Vibration Guide Wire
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Solution Overview
Problem
Current terahertz wave-based inspection technologies face limitations in practical applications due to resolution and imaging speed issues, hindering their adoption in industries like semiconductors that require high-speed and high-resolution non-destructive inspection methods.
Innovation Solution
A sample inspection device and method utilizing a total inspection module for rapid scanning of multiple samples and a precision inspection module for detailed analysis of suspected defective samples, employing terahertz waves, a guide wire for directional guidance, and a vibration unit to enhance inspection efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a single inspection module is used for all samples, then inspection coverage is comprehensive, but inspection time increases and productivity decreases
Solution Approach 1:
The inspection system is divided into two independent modules: a total inspection module for rapid scanning of all samples to identify suspected defective areas, and a precision inspection module for detailed examination of only those suspected areas. This segmentation allows the system to achieve both high productivity through rapid initial screening and high measurement precision through focused detailed inspection of only the necessary samples.
2Measurement precision
If high-resolution inspection is performed on all samples, then detection accuracy is high, but inspection time increases significantly
Solution Approach 1:
Instead of performing high-resolution precision inspection on all samples, the system applies partial action by conducting detailed precision inspection only on samples identified as suspected defective by the total inspection module. This approach maintains high detection accuracy for problematic samples while minimizing the time loss associated with exhaustive high-resolution scanning of every sample.
3Reliability
If terahertz wave inspection is used, then non-destructive inspection capability is achieved, but resolution and imaging speed are insufficient for practical industry application
Solution Approach 1:
The system segments the inspection process into two stages using terahertz waves: a total inspection stage that rapidly scans all samples to maintain high productivity, and a precision inspection stage that provides high-resolution non-destructive examination of suspected defective samples. This segmentation allows the system to overcome the inherent limitation of terahertz wave technology by applying different inspection depths and resolutions appropriately to different samples.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables fast and high-resolution non-contact, non-destructive inspection of samples, reducing inspection time and improving detection accuracy by leveraging the terahertz wave's properties for effective sample evaluation.
Implementation Method 1
an emitter emitting a terahertz wave to the first area
Implementation Method 2
a guide wire guiding an irradiation direction of the terahertz wave
Implementation Method 3
a vibration unit vibrating the guide wire
Data Source
AI summary
According to one embodiment of the present invention, A sample inspection device may provided, a total inspection module scanning a first area comprising a plurality of samples; a precision inspection module performing inspection on a sample determined as a suspected defective sample by the total inspection module in the first area; and a controller processing each data obtained from the total inspection module and the precision inspection module, and detecting a defective sample in the first area, wherein the precision inspection module may include an emitter emitting terahertz wave to the first area, a guide wire guiding an irradiation direction of the terahertz wave, and a vibration unit vibrating the guide wire.


