Integrated Optoelectronic Circuit Board Structure
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Solution Overview
Problem
Traditional circuit board structures face challenges in miniaturization, signal loss, noise interference, and increased production costs due to the use of copper circuits and mechanical insertion of optical fibers, which hinder the development of high-frequency and high-data-capacity semiconductor devices.
Innovation Solution
A circuit board structure with integrated optoelectronic components, featuring a carrying board with openings for optoelectronic components, a dielectric layer, a circuit layer, and a build-up circuit layer structure that embeds optical transmission components, eliminating the need for grooves and allowing direct alignment and connection, thus simplifying production and enhancing signal transfer quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If optical fibers are mechanically inserted into grooves in the circuit board, then optical signal transmission is achieved, but the production process becomes complex and productivity decreases
Solution Approach 1:
The patent merges the optical fiber with the circuit board structure by embedding the optical fiber directly into the circuit board during the manufacturing process, eliminating the need for separate mechanical insertion into grooves. This integration simplifies the production process and increases productivity while maintaining optical signal transmission quality.
Solution Approach 2:
The optical fibers are prepared and positioned in advance during the circuit board manufacturing process, before the final assembly stage. This preliminary action allows for more efficient production flow and eliminates time-consuming post-assembly insertion operations, thereby increasing productivity.
2Power
If copper circuits are used for signal transmission, then electrical signals can be transmitted, but signal loss and noise interference increase at high frequencies
Solution Approach 1:
The patent changes the fundamental parameter of signal transmission from electrical signals through copper circuits to optical signals through optical fibers. This parameter change enables high-frequency signal transmission with minimal signal loss and noise interference, as optical signals are not susceptible to electromagnetic interference that plagues copper circuits at high frequencies.
3Reliability
If protective measures are added to prevent electromagnetic interference, then signal reliability improves, but design complexity and production costs increase
Solution Approach 1:
The patent extracts the problem of electromagnetic interference by using optical signals instead of electrical signals. Since optical signals are inherently immune to electromagnetic interference, the need for protective measures such as shielding and filtering is eliminated, thereby reducing design complexity and production costs while maintaining or improving signal transmission reliability.
4Measurement precision
If optical alignment systems of high precision are used, then optical signal transmission accuracy improves, but the system size increases and miniaturization is hindered
Solution Approach 1:
The patent merges the optical alignment function directly into the circuit board structure through precise embedding of optical fibers during manufacturing. This integration eliminates the need for separate, bulky optical alignment systems, achieving high alignment precision while maintaining a compact form factor that supports miniaturization.
Solution Approach 2:
The optical alignment is performed in advance during the circuit board manufacturing process, allowing for precise positioning and fixation of optical fibers before the product reaches the customer. This preliminary alignment action eliminates the need for complex, large-scale alignment systems in the final product, enabling miniaturization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces signal loss, noise, and production costs, while increasing wiring density and productivity, and supports the miniaturization of electronic devices by embedding optical transmission components within the build-up circuit layer structure, improving signal transfer quality and alignment efficiency.
Implementation Method 1
at least an optical transmission component that is embedded within the build-up circuit layer structure, one of the transmission ends of the optical transmission component is facing and exposed through the first opening, and is opposite to the optical active area of the first optoelectronic component, whereas the other transmission end is facing and exposed through the second opening
Data Source
AI summary
A circuit board structure of integrated optoelectronic components is composed of: a carrying board with at least one through opening; a first optoelectronic component accommodated in the through opening, which has an active surface and a non-active surface. A dielectric layer, a circuit layer and build-up layers are successively formed on the active surface of the optoelectronic component and the carrying board. A first opening penetrates the dielectric layer and the circuit layer while a second opening penetrates the build-up layers. The present invention provides that the circuit layer is directly formed on the surface of the first optoelectronic component so that the registration between the circuit layer and the electrode pads of the optoelectronic component is improved. Moreover, the optical transmission component for transmitting signal is integrated in the build-up circuit layer. Thus, the cost is reduced, the production is improved and the volume is shrunken.