Antenna System with Integrated Radiator Packages
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Solution Overview
Problem
Phased array antennas face challenges in accommodating support electronics at high frequencies due to the limited space required by small radiator elements, leading to increased size and fabrication costs with multiple circuit boards.
Innovation Solution
Integrating radiator packages with integrated circuits and support packages on a single antenna substrate, where radiator packages include radiator elements and integrated circuits like amplifiers and phase shifters, and support packages include phase shifters and amplifiers, interconnected through a multilayer antenna substrate for beam forming networks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple circuit boards are used to accommodate support electronics, then the available space for electronics is increased, but the overall device size and fabrication complexity increase
Solution Approach 1:
The patent combines multiple circuit boards into a single integrated circuit board that accommodates both radiator elements and support electronics. The integrated circuit board includes a substrate with radiator elements on a first surface and support electronics on a second surface, eliminating the need for multiple separate boards and their complex interconnections.
Solution Approach 2:
The patent utilizes the third dimension by stacking radiator elements and support electronics on opposite surfaces of the same circuit board. This vertical arrangement allows both components to coexist in the same planar footprint, effectively doubling the usable area without increasing the device's footprint or complexity.
2Measurement precision
If the number of radiator elements is increased to improve beam focusing, then the antenna performance is improved, but the area occupied by the antenna increases
Solution Approach 1:
The patent arranges radiator elements and support electronics in a stacked configuration on opposite surfaces of the circuit board. This allows the antenna to achieve high beam focusing capability with multiple radiator elements without proportionally increasing the planar area, as the support electronics occupy the same footprint in a different dimension.
Solution Approach 2:
The patent merges the functions of radiator elements and support electronics into a single integrated structure. By combining these previously separate components into one circuit board assembly, the patent reduces the overall area required while maintaining the ability to deploy multiple radiator elements for improved beam focusing.
3Volume of moving object
If the operating frequency is increased to reduce radiator element size, then the device compactness is improved, but the available space for support electronics decreases
Solution Approach 1:
The patent places support electronics on the opposite surface of the circuit board from the radiator elements. This vertical separation allows the radiator elements to be miniaturized for high-frequency operation without compromising the space available for support electronics, as both components occupy different dimensions of the same integrated structure.
Solution Approach 2:
The patent integrates radiator elements and support electronics into a single circuit board assembly, where both components share the same physical structure but occupy different surfaces. This merging allows the radiator elements to be scaled down for high-frequency operation while the support electronics maintain adequate space on the opposite surface.
4Adaptability or versatility
If discrete components are interconnected on multiple circuit boards, then the functionality is achieved, but the fabrication and assembly costs increase
Solution Approach 1:
The patent combines multiple circuit boards with discrete components into a single integrated circuit board with integrated circuits. This consolidation reduces the number of interconnections required, simplifies the assembly process, and lowers fabrication and assembly costs while maintaining the same circuit functionality.
Solution Approach 2:
The integrated circuit board serves multiple functions simultaneously: it provides the substrate for radiator elements, hosts support electronics, and integrates interconnections between all components. This multi-functionality eliminates the need for separate circuit boards and reduces overall system complexity and cost.
Data Source
AI summary
An antenna system that includes one or more radiator packages on a first side of an antenna substrate and one or more support packages on a second side of the antenna substrate are provided. Embodiments of the present invention include antenna systems incorporating a plurality of radiator packages on a first side of the antenna substrate and a plurality of support packages on the second side of the antenna substrate. The radiator packages generally include a radiator element and an integrated circuit that are incorporated into a common package. The integrated circuit of the radiator package can comprise an amplifier and/or other electronic components. The support packages generally provide one or more additional electronic components. For example, a support package integrated circuit can provide a phase shifter, amplifier, and/or other electronic components. The antenna substrate generally incorporates electrical conductors for operatively interconnecting each radiator package to at least one support package.