Antenna Arrays TRIZ Cases

A laser direct structuring antenna stand adheres to an electronic device front case body via a through hole and adhesive.

Replacing heavy slip-rings, this wireless antenna system eliminates friction wear and signal interference while enabling reliable data transmission.

A conductive structure couples antennas to generate a cancelling signal, reducing mutual interference while maintaining compact device size.

Air cavities between antenna patches and substrates boost impedance bandwidth, reducing absorption losses from device back covers.

An extendable phased array antenna in a mobile device case enables 5G communication by positioning the array away from the user to reduce radiation exposure.

Transitional regions with adjustable steps and ridges redirect electromagnetic waves between horizontal and vertical waveguides.

Half-patch launchers inject amplified signals into a waveguide to form a combined transmission signal.

Isolating the RF connector center pin eliminates galvanic contacts that generate passive intermodulation, reducing interference below -140 dBc.

A double-loop antenna configuration merges parallel loops to maintain compact size while extending communicable distance.

Segmented transmission elements couple to a feed element, expanding bandwidth and compatibility across multiple wireless standards.

A multi-feed diversity antenna system uses spatially separated feed elements to capture wireless signals with directional diversity.

Orthogonal reflection units redirect dual-band signals to resolve the trade-off between beam adjustment capability and structural complexity.

Stacked patch antennas in a phased array resolve space constraints while maintaining signal integrity during spatial ranging.

Replacing rigid waveguides with polymeric film substrates reduces antenna weight while allowing the structure to fold for small-volume storage.

Vertically stacked parasitic antenna arrays eliminate interconnect impedance losses at microwave frequencies, enabling multiband operation for UAV platforms.

A low-frequency grounding component couples high-frequency radiators to a ground plane.

A Miura-ori folding pattern reduces antenna array surface area while maintaining discrete element placement for efficient beamforming.

Segmented load circuits compensate for interconnect impedance effects, increasing directional gain at microwave frequencies.

A semiconductor package uses a stepped insulating layer to expose the antenna feeding region for optimized signal transmission.

Segmented support bodies disperse thermal stresses to prevent deformation and preserve electromagnetic radiation characteristics in miniaturized devices.

Processing circuitry classifies rotating devices into priority groups, reducing beam formation time while suppressing current consumption spikes.

A smooth unitary matrix approach determines beamforming coefficients for multiple tone communication channels.

A dielectric support isolates the antenna from internal metal structures, mitigating radiation pattern distortion and maintaining beamforming uniformity.

A hybrid microstrip patch antenna and waveguide structure transmits electromagnetic signals with minimal loss.

A fan-shaped waveguide antenna distributes signals via coplanar slots and inductive posts.

A pocket in a dielectric layer embeds an integrated circuit to minimize interconnect length and reduce parasitic inductance.

Dynamic substrate deformation reconfigures sensor geometry to achieve 360-degree coverage with fewer arrays.