Semiconductor Package Stepped Insulating Layer Antenna Signal Attenuation
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Solution Overview
Problem
Millimeter wave signal attenuation poses a significant challenge in high-frequency wireless transmission, particularly in mobile communication systems, where achieving stable and high-speed data rates is crucial.
Innovation Solution
A semiconductor device package is designed with an antenna layer and an insulating layer forming a stepped structure, exposing the feeding region to optimize signal transmission. The insulating layer has a first portion in contact with the antenna layer and a second portion defining a larger opening over the first, creating a stepped structure that enhances signal exposure and reduces attenuation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a conventional antenna structure is used, then the device structure is simple, but signal attenuation is high at millimeter wave frequencies
Solution Approach 1:
The insulating layer is segmented into multiple portions (first insulating layer portion, second insulating layer portion, third insulating layer portion) with different opening sizes, creating a stepped structure that exposes different regions of the antenna layer. This segmentation allows optimization of signal transmission at different locations while maintaining structural organization.
Solution Approach 2:
Different portions of the insulating layer have different opening sizes tailored to specific functional requirements. The first opening exposes the feeding region for optimal signal input, while the second and third openings expose radiating regions for effective signal transmission. This local differentiation optimizes signal transmission quality at each specific location.
2Reliability
If the insulating layer completely covers the antenna layer, then the structure is simple and protected, but the feeding region is not exposed and signal transmission is poor
Solution Approach 1:
The insulating layer is formed with pre-defined openings during the manufacturing process, specifically positioning the first opening to expose the feeding region and subsequent openings to expose radiating regions. This preliminary structuring ensures optimal signal transmission paths are established before the antenna is assembled and operated.
Solution Approach 2:
The insulating layer transitions from a flat, uniform structure to a stepped, multi-level structure with varying heights and opening sizes. This dimensional change creates multiple exposure zones that optimize signal transmission while maintaining the protective function of the insulating layer.
3Reliability
If openings are made larger to expose more antenna regions, then signal transmission improves, but structural stability decreases
Solution Approach 1:
Rather than creating one large opening that would compromise structural integrity, the design segments the opening into multiple smaller portions (first opening, second opening, third opening) with different sizes and positions. This segmentation maintains structural stability while collectively exposing sufficient antenna regions for optimal signal transmission.
Solution Approach 2:
Each opening portion is locally optimized for its specific function: the first opening is sized to expose the feeding region appropriately, while the second and third openings are sized to expose radiating regions. This local optimization ensures signal transmission requirements are met without unnecessarily reducing structural stability across the entire insulating layer.
Data Source
AI summary
The present disclosure relates to a semiconductor device package. The semiconductor device package includes an antenna layer having a feeding region and an insulating layer disposed on the antenna layer. The insulating layer has a first portion in contact with the antenna layer and a second portion on the first portion. The first portion and the second portion of the insulating layer define a stepped structure exposing the feeding region of the antenna layer. A method of manufacturing a semiconductor device package is also disclosed.