Integrated Resonator Structure for Temperature-Stable Frequency Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing frequency control devices face challenges in minimizing frequency instability due to temperature differences between high and low frequency resonators and temperature sensing elements, requiring expensive high-resolution analog-to-digital converters for computational frequency correction.
Innovation Solution
A single structure that closely thermally couples a high frequency resonator, a low frequency resonator, and a temperature sensing element, eliminating the need for expensive converters by using a single temperature sensing element for both resonators, housed in the same hermetic cavity or separate packages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If computational frequency correction is used to minimize frequency instability, then frequency stability is improved, but expensive high-resolution analog-to-digital converters are required
Solution Approach 1:
The patent combines the high frequency resonator, low frequency resonator, and temperature sensing element into a single integrated structure where all three elements are closely thermally coupled. This merging eliminates the need for separate temperature sensing for each resonator, allowing a single temperature measurement to serve both frequency correction purposes, thereby removing the requirement for expensive high-resolution analog-to-digital converters
Solution Approach 2:
The single temperature sensing element performs multiple functions by providing temperature data for both the high frequency resonator and low frequency resonator simultaneously. This multi-functional approach allows one sensor to replace what would traditionally require multiple sensors and associated conversion circuitry, reducing system complexity and cost while maintaining frequency stability
2Reliability
If separate temperature sensing is used for high and low frequency resonators, then individual frequency correction is achieved, but device size and cost increase
Solution Approach 1:
The patent merges the temperature sensing function into a single shared element that thermally couples to both resonators. This integration reduces the physical footprint by eliminating redundant sensing components and interconnection structures, while the close thermal coupling ensures accurate temperature measurement for both resonators using the single sensing element
3Measurement precision
If high-resolution analog-to-digital converters are used for temperature sensing, then temperature measurement precision is improved, but device cost and power consumption increase
Solution Approach 1:
The patent replaces expensive, high-power high-resolution analog-to-digital converters with simpler, lower-cost, and lower-power conversion circuitry. By using the single temperature sensing element to provide temperature data for both resonators, the system can use less demanding conversion methods that consume less power and cost less, while still achieving sufficient measurement precision for frequency correction
Solution Approach 2:
The single temperature sensing element serves both resonators simultaneously, reducing the total measurement precision requirement compared to having separate high-resolution sensing for each resonator. This universal sensing approach allows use of simpler conversion circuitry with lower power consumption while maintaining adequate temperature measurement accuracy for both frequency correction functions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances temperature sensing accuracy and resolution, reduces physical size and cost, and minimizes power consumption by allowing a single measurement for both resonators, eliminating the need for high-resolution converters.
Implementation Method 1
all three elements are closely thermally coupled so that the temperature difference between any of the three elements is further reduced
Data Source
AI summary
A single frequency control device incorporating a high frequency resonator, a low frequency resonator and a temperature sensing element, the latter thermally coupled closely to the said resonators to facilitate temperature sensing with higher resolution and accuracy. Additional benefits offered by the structure include smaller size and lower cost.

