A spiral inlay LC oscillator uses over-the-air calibration and a temperature look-up table to replace crystal references with lower power and size.
Two oscillators with opposite temperature-frequency slopes feed a time-domain sigma-delta modulator for robust, accurate digital temperature sensing.
A parallel compensation module and lookup table ROM correct short-time thermometer errors, enabling faster and more accurate readings.
Connection sensors verify mounting integrity so non-invasive temperature readings stay accurate despite vibration, spring damage, or improper fit.
Periodic diode-based calibration enables accurate temperature sensing with lower power use for pressure and combination sensor compensation.
Selective potential switching keeps sensor array outputs measurable after wiring breaks and helps identify resistance values and break locations.
A hardware slew-rate circuit detects fast temperature rises early, reducing host processing load and helping protect components before overheating.
Predictive temperature-based gain compensation keeps piezoelectric driving signals stable despite capacitance changes in the vibration circuit.
Real-time temperature sensing modulates playback gain in stages to prevent overheating without abrupt shutdowns or unnecessary over-engineering.
Pre-charging column-line parasitic capacitance enables faster steady-state voltage readout and more accurate resistance measurement.
Connection sensors track proximity, position, or force to catch loose mounting and keep non-invasive process temperature readings reliable.
Reference and correction capacitive circuits compensate process variation, improving detection of temperature-driven capacitance changes.
Time-shared currents and differential potential sensing cut per-core wiring while preserving accurate chip temperature monitoring.
Staged temperature-triggered gain reduction protects playback hardware from overheating while avoiding abrupt shutdowns that disrupt listening.
Predicts circuit and element temperature from drive signals to compensate gain shifts and keep piezoelectric vibration stable.
A spiral single-layer inductor and IC capacitor cut IoT oscillator power while improving frequency stability and temperature sensing.
Modulated clock signals carry control data across an isolated sensor interface, preserving measurement signal integrity with fewer lines.
A groove between the heater and sensor reduces thermal mismatch, helping the sensor track resonator temperature more accurately.
Real-time temperature sensing lowers audio gain in stages to prevent overheating damage while avoiding abrupt playback shutdowns.
Close thermal coupling lets one sensor track both resonators, improving frequency correction accuracy while cutting size, cost, and power.
Oscillation counting replaces slave-chip ADCs and precise timers, cutting interface complexity, cost, and radioelectric interference.
Separating electrode pads from the recessed sensor area cuts thermal stress and heat influence, improving crystal frequency-temperature stability.
Multiple TOF pulses with changing comparator references estimate pulse peak time and cut distance error, even for weak reflections.
Dissimilar PCB traces and board stiffeners use the Seebeck effect to detect which board edge is nearest a sudden high-temperature source.
Gate-current sensing uses internal control-node resistance to track power switch junction temperature continuously without external sensors.
Stepwise PWM duty updates from a temperature sensor keep LCD brightness smooth while protecting liquid crystal stability during temperature changes.
Stored switch configuration data stabilizes MOSFET array on-resistance for accurate current sensing with lower power loss and heat.
Group delay detection replaces direct resonance tracking to measure resonant sensors faster, with high sensitivity, low power, and wider linearity.
Temperature-based reference correction stabilizes grip sensor output in electronic devices and prevents false touch or hovering detection.
Earliest-transition signal selection triggers actions without waiting for all inputs, while acknowledgement prevents missed or repeated operations.
Periodic force and sense switching in a 1:N BJT array averages mismatch errors, improving on-chip temperature sensing accuracy with less area.
Switching A/D conversion modes by temperature condition reduces frequency hopping while preserving fast response in temperature-compensated oscillators.
Parallel strand current sensing with MUX selection keeps LED currents equal, improving light uniformity and protection under variable conditions.