Integrated Environmental Sensor With Inkjet-Deposited RDL Sensing
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Solution Overview
Problem
Existing environmental sensors have large footprints, are time-intensive and expensive to manufacture, and are prone to ionic contamination, leading to poor reliability, especially in adverse environments.
Innovation Solution
A highly integrated environmental sensor is developed with a redistribution layer (RDL) containing active semiconductor circuits and sensing elements, which are etched and deposited using inkjet material deposition, and protected by a sealed portion, allowing for rapid, low-cost manufacturing and improved reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional metal oxide sensors are used, then sensing function is achieved, but manufacturing time and cost increase significantly
Solution Approach 1:
The patent combines multiple separate manufacturing steps into a single inkjet printing process. The sensing element, electrodes, and interconnectors are deposited simultaneously in one printing operation, eliminating sequential processing steps and dramatically reducing manufacturing time while maintaining sensor functionality.
Solution Approach 2:
The invention changes the manufacturing approach from traditional time-intensive sintering and assembly processes to rapid inkjet printing with controlled drying and curing parameters. By optimizing printing material composition and curing conditions, the sensor achieves functional performance with significantly reduced processing time.
2Reliability
If traditional environmental sensor packaging is used, then sensor protection is provided, but ionic contamination risk increases in adverse environments
Solution Approach 1:
The patent transitions from traditional three-dimensional packaged sensors to a planar, two-dimensional sensor structure. This dimensional change allows the entire sensing element to be sealed within a flat substrate, eliminating internal cavities where ionic contamination could accumulate while maintaining protective sealing.
Solution Approach 2:
The invention uses thin-film sealing layers deposited directly over the sensing elements to provide protection against ionic contamination. These thin films create a barrier that prevents ion penetration while allowing the sensor to maintain direct environmental exposure for accurate measurements.
3Area of stationary object
If sensor footprint is reduced for compact applications, then integration density increases, but manufacturing complexity increases
Solution Approach 1:
The inkjet printing process used in the patent is inherently multi-functional, capable of depositing different materials (sensing elements, electrodes, interconnectors, sealing layers) using the same equipment and process parameters. This universality allows complex miniaturized structures to be manufactured without proportionally increasing manufacturing complexity.
Solution Approach 2:
The sensor structure is segmented into distinct functional layers (sensing element, electrodes, interconnectors, sealing layer) that are deposited in a controlled sequence. This segmentation allows each component to be optimized independently while maintaining overall compact integration, reducing the total sensor footprint without complicating the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The sensor provides enhanced sensitivity, improved signal-to-noise ratio, and increased longevity while being cost-effective, suitable for various applications, including smoke detectors and air quality monitoring.
Implementation Method 1
Environmental sensors may be exposed to the environment surrounding the sensor to operate. Such exposure creates risk of ionic contamination, especially in adverse environments such as factories or seawater.
Implementation Method 2
The environmental sensor may include a first sensing element deposited in a first trench etched on the RDL using inkjet material deposition.
Implementation Method 3
The first sensing element may be laser annealed.
Data Source
AI summary
A system and method for a highly integrated environmental sensor and process for manufacturing said sensor is disclosed. Examples of the present disclosure may include an integrated sensor. The integrated sensor may include a redistribution layer (RDL). The integrated sensor may also include a control circuit coupled to the RDL. The integrated sensor may additionally include an analog front-end circuit coupled to the RDL and the control circuit. The integrated sensor may further include an environmental sensor coupled to the analog front-end circuit. The environmental sensor may include a first sensing element deposited in a first trench etched on the RDL using inkjet material deposition.