Integrated Sensor Modules With Opaque Optical Barrier
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Solution Overview
Problem
Existing optical sensors in portable devices face challenges in minimizing optical crosstalk and achieving compact size, which is crucial for wearable devices and other portable applications where space and weight are limited.
Innovation Solution
The integration of packaged light source semiconductor devices (PLSSDs) and packaged light detector semiconductor devices (PLDSDs) within a pre-molded cover structure, with an opaque barrier to isolate them optically, and the use of light transmissive adhesives to minimize reflections, forming an integrated sensor module that can be mounted on a substrate with a gap between the light source and detector.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If optical sensors are made compact for portable devices, then device size and weight are reduced, but optical crosstalk between light source and detector increases
Solution Approach 1:
The patent introduces an opaque barrier structure positioned between the light source and light detector to block stray light paths. This intermediary element prevents optical crosstalk while allowing the sensor module to maintain a compact form factor suitable for portable devices.
Solution Approach 2:
The patent applies light transmissive adhesive material specifically at the interface between the light source/detector and the window, rather than throughout the entire structure. This localized application minimizes reflections at critical interfaces without requiring changes to the overall compact design.
2Volume of moving object
If optical sensors are made compact for wearable devices, then space and weight are reduced, but manufacturing complexity increases
Solution Approach 1:
The patent integrates multiple functions into a single pre-molded cover structure that combines the window, opaque barrier, and adhesive layers. This merging of components simplifies the manufacturing process by reducing the number of separate parts that need to be assembled, while still achieving the compact sensor module design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces optical crosstalk and allows for a compact design, enhancing the performance and miniaturization of optical sensors in wearable devices and other portable applications.
Implementation Method 1
an opaque barrier to isolate them optically
Implementation Method 2
the use of light transmissive adhesives to minimize reflections
Data Source
AI summary
An integrated sensor module includes one or more packaged light source semiconductor devices and one or more packaged light detector semiconductor devices mounted to a top surface of a substrate. A pre-molded cover structure includes a portion molded from an opaque molding compound and a further portion molded from a light transmissive molding compound. For each of the packaged light source and light detector semiconductor devices, the pre-molded cover structure includes a pre-molded cavity covered by a window formed of the light transmissive molding compound. The pre-molded cover structure is attached to the substrate such that each of the packaged light source and light detector semiconductor devices fits within a respective cavity, and such that a barrier formed of the opaque molding compound is positioned between each packaged light source semiconductor device and light detector semiconductor device. The module can also include additional sensors and/or electrodes for use by sensors.