Integrated Shield Portion for Electronic Component Modules

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Solution Overview

Problem

Existing electronic component modules are susceptible to electromagnetic waves, leading to degradation of electromagnetic shielding performance, which affects the reliability and efficiency of electronic components, especially those with high-frequency bands.

Innovation Solution

The integration of a first conductor layer between the electronic component and the resin structure and a second conductor layer between the wiring layers and the resin structure, with both layers being made of the same material to form a continuous shield portion, reduces the interface and thus minimizes degradation of electromagnetic shielding performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If separate first and second conductor layers are provided between the electronic component and resin structure, then electromagnetic shielding is improved, but interface degradation reduces shielding performance

Engineering Contradiction:

Improveelectromagnetic shielding performanceVSAvoidinterface between conductor layers

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the first conductor layer and second conductor layer into a single integrated conductor layer that provides continuous electromagnetic shielding. This eliminates the interface between separate layers, preventing degradation while maintaining shielding effectiveness. The integrated layer is positioned to shield both the electronic component and wiring layers simultaneously.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent ensures continuous electromagnetic shielding by providing an uninterrupted conductor layer throughout the resin structure. This continuous configuration prevents signal leakage and maintains consistent shielding performance, avoiding the discontinuity that would occur at interfaces between separate conductor layers.

Inventive Principle:

Principle #20Continuity of useful action

2Reliability

If conductor layers are integrated to eliminate interfaces, then electromagnetic shielding performance is maintained, but manufacturing complexity increases

Engineering Contradiction:

Improveelectromagnetic shielding performanceVSAvoidintegration of conductor layers

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent incorporates the conductor layer into the resin structure during the molding process itself, rather than adding it as a separate post-processing step. This preliminary integration simplifies manufacturing by combining multiple operations into one, while ensuring the conductor layer is properly positioned and continuous from the outset.

Inventive Principle:

Principle #10Preliminary action

3Ease of manufacture

If the shield portion is positioned away from the electronic component and wiring layers, then manufacturing flexibility is improved, but shielding effectiveness may be reduced

Engineering Contradiction:

Improvepositioning flexibility of shield portionVSAvoidelectromagnetic shielding effectiveness

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent designs the integrated conductor layer to serve multiple shielding functions simultaneously. It provides electromagnetic shielding for both the electronic component and the wiring layers, eliminating the need for separate shield portions positioned at different locations. This multi-functional approach maintains shielding effectiveness while improving manufacturing flexibility.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances the long-term reliability of electromagnetic shielding, reduces the influence of external electromagnetic waves on through-wires, and minimizes propagation losses of radio-frequency signals, maintaining the integrity of electronic components even at high-frequency bands.

Implementation Method 1

the first conductor layer and the second conductor layer are integrated... degradation of electromagnetic shielding performance to block electromagnetic waves from the outside is significant

Methodology Applied

Scientific EffectElectromagnetic shielding: Faraday Cage

Data Source

PatentUS11257730B2Electronic component module, and manufacturing method for electronic component module

Publication Date: 2022.02.22 MURATA MFG CO LTD

AI summary

An electronic component module includes an electronic component, a resin structure, a wiring portion, and a shield portion. The resin structure covers a second main surface and at least a portion of a side surface of the electronic component. The wiring portion is electrically connected to the electronic component. The shield portion includes a first conductor layer and a second conductor layer. The first conductor layer is spaced away from the electronic component between the electronic component and the resin structure, and has electrical conductivity. The second conductor layer is spaced away from the wiring portion between the wiring portion and the resin structure, and has electrical conductivity. In the shield portion, the first conductor layer and the second conductor layer are integrated.