Integrated TCXO Layout for Tight Frequency Temperature Stability
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Solution Overview
Problem
Current temperature-compensated crystal oscillators (TCXOs) do not achieve frequency temperature characteristics similar to oven-controlled crystal oscillators (OCXOs), leading to high manufacturing costs for communication devices requiring high frequency accuracy.
Innovation Solution
A temperature-compensated oscillator design where the semiconductor device and resonator element are spatially close, with the semiconductor device's heat conducted to the resonator element quickly, reducing temperature differences and achieving frequency deviations within ±150 ppb across a wide temperature range, similar to OCXOs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a TCXO uses conventional spatial separation between semiconductor device and resonator element, then manufacturing cost is reduced, but frequency temperature characteristics deteriorate and cannot match OCXO performance
Solution Approach 1:
The patent merges the semiconductor device and resonator element into a closely integrated configuration where the semiconductor device is positioned immediately adjacent to the resonator element. This spatial merging enables efficient heat conduction from the semiconductor device to the resonator element, achieving frequency temperature characteristics comparable to OCXOs while maintaining TCXO manufacturing simplicity.
2Measurement precision
If a TCXO achieves OCXO-level frequency accuracy, then it can be used in high-precision communication apparatus, but manufacturing cost increases
Solution Approach 1:
The patent achieves OCXO-level frequency accuracy through a cost-effective TCXO implementation by merging the semiconductor device and resonator element in close proximity. This configuration enables natural heat conduction that stabilizes the resonator element temperature, achieving frequency deviations within ±150 ppb over the industrial temperature range without requiring expensive OCXO manufacturing processes.
3Stability of the object's composition
If the semiconductor device and resonator element are placed close together, then heat conduction improves and frequency stability increases, but device complexity increases
Solution Approach 1:
The patent implements frequency stability enhancement through a simple merging of the semiconductor device and resonator element in close proximity. The device structure maintains simplicity by using direct thermal coupling without complex thermal management systems, achieving frequency stability through the natural heat conduction that occurs when the semiconductor device and resonator element are positioned adjacent to each other.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables a cost-effective temperature-compensated oscillator with frequency stability comparable to OCXOs, suitable for electronic apparatuses and moving objects requiring high frequency accuracy, while reducing manufacturing costs.
Implementation Method 1
the heat of the semiconductor device is conducted to the resonator element in a short time
Data Source
AI summary
An oscillator includes a resonator element; and a semiconductor device including an oscillation circuit which outputs an oscillation signal by oscillating the resonator element, a temperature compensation circuit which compensates for temperature characteristics of a frequency of the oscillation signal, and a first surface in which a terminal that is electrically connected to the resonator element is disposed. The semiconductor device overlaps the resonator element in a planar view. Frequency deviation of the oscillation signal, which is compensated for by the temperature compensation circuit, is greater than or equal to −150 ppb and smaller than or equal to +150 ppb in a temperature range from −5° C. to +85° C.