Integrated UV Light Source in SoC Package for Selective Erasure
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Solution Overview
Problem
Current UV erasable memory technologies, such as EPROMs, require external UV light sources and expensive ceramic or quartz packaging, leading to high costs and limited scalability, as well as non-selective blanket erasure of memory elements.
Innovation Solution
Integration of a UV light source within a System on Chip (SoC) package using flip-chip mounting and a carrier with bond pads, allowing for in-field UV exposure and hermetically sealed packaging without the need for expensive ceramic or quartz, enabling precise and cost-effective UV erasure and reprogramming.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If external UV light sources are used with ceramic or quartz packaging, then UV erasure function is achieved, but manufacturing cost increases and scalability is limited
Solution Approach 1:
The patent combines the UV light source and the computer chip into a single integrated package, eliminating the need for separate external UV sources and expensive ceramic/quartz packaging. The UV LED is mounted in close proximity to the chip, allowing direct UV exposure through the package substrate, thereby achieving the UV erasure function while significantly reducing manufacturing costs and improving scalability.
2Reliability
If external UV light sources are used, then UV erasure is achieved, but package dimensions increase and throughput decreases
Solution Approach 1:
By integrating the UV light source directly with the computer chip in a single package, the patent eliminates the need for large external UV sources and associated packaging infrastructure. This integration dramatically reduces package dimensions and enables higher throughput by allowing parallel processing and compact arrangement of multiple devices.
3Reliability
If external UV light sources are used, then UV erasure is achieved, but selectivity is lost due to blanket erasure
Solution Approach 1:
The integrated UV light source is positioned to illuminate only specific regions of the computer chip, enabling selective erasure of particular memory areas or functional blocks. The close proximity and controlled geometry of the integrated UV LED allow for localized UV exposure, providing precise spatial control over which areas undergo erasure, thereby achieving high erasure selectivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides a cost-effective, scalable, and selective UV erasure method for programmable chips, reducing manufacturing costs and enabling smaller package dimensions with higher throughput and precision, while eliminating the need for external UV sources and expensive materials.
Implementation Method 1
The UV light source can be configured to emit UV light towards a UV erasable area of the computer chip to perform UV erasing on the computer chip
Implementation Method 2
structures or particular computer chips (e.g., neuromorphic inference chips, artificial intelligence chips) made of ionic conducting polymers can rely on UV light exposure to move or remove ions to alter the resistivity of the structure
Data Source
AI summary
Programmable devices and methods for fabricating the programmable devices are described. In an example, a method for fabricating a programmable device can include bonding a UV light source to a computer chip by flip-chip mounting the UV light source to the computer chip. The UV light source can be configured to emit UV light towards a UV erasable area of the computer chip to perform UV erasing on the computer chip. The method can further include bonding a carrier to the computer chip by flip chip mounting the computer chip to the carrier using a second array of bond pads.