Integrated Wavelength Conversion Film for LED Packages
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Solution Overview
Problem
Light emitting device packages with individually attached wavelength conversion films suffer from non-uniform adhesive forces and color uniformity issues due to varying adhesive strengths, leading to inconsistent white light emission and reliability problems.
Innovation Solution
A light emitting device package design where at least two light emitting devices share a single integrated wavelength conversion film, with a recess through the film to accommodate gaps between devices and a reflective member surrounding the side surfaces, enhancing uniformity and stress relief.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If wavelength conversion films are individually attached to each LED, then each LED can be independently assembled, but adhesive force varies and color uniformity decreases
Solution Approach 1:
The patent merges multiple individual wavelength conversion films into a single integrated wavelength conversion film that covers multiple LEDs simultaneously. This integration ensures uniform adhesive force distribution across all LEDs, eliminating the color uniformity issues caused by varying adhesive forces in individual film attachments, while still allowing independent LED assembly processes.
2Manufacturing precision
If a single integrated wavelength conversion film is used for multiple LEDs, then color uniformity improves, but stress concentration may occur
Solution Approach 1:
The patent segments the integrated wavelength conversion film by forming recesses at the boundaries between adjacent LEDs. These recesses divide the continuous film into distinct regions, preventing stress concentration at LED boundaries while maintaining the overall integration benefits for color uniformity. The recesses act as stress relief zones that accommodate thermal expansion differences.
3Ease of manufacture
If wavelength conversion film covers gap regions between LEDs, then manufacturing is simplified, but light leakage may occur
Solution Approach 1:
The patent extracts or removes the wavelength conversion film material from the gap regions between adjacent LEDs by forming recesses at these boundaries. This extraction prevents light leakage through the gaps while maintaining the simplified manufacturing benefits of using a single integrated film structure. The recesses create physical separation zones that block stray light.
4Object-generated harmful factors
If recesses are formed in the wavelength conversion film at gap regions, then light leakage is prevented, but manufacturing complexity increases
Solution Approach 1:
The patent applies local quality changes by forming recesses only at specific critical locations (gap boundaries between LEDs) rather than uniformly across the entire film. This localized modification prevents light leakage where it matters most while maintaining film integrity and simplicity in other regions, minimizing the increase in manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves color uniformity, reliability, and light emission consistency by ensuring uniform adhesive force distribution and stress relief, while preventing light leakage from side surfaces, thus enhancing the overall performance of the light emitting device package.
Implementation Method 1
an integrated wavelength conversion film disposed on the at least two light emitting devices
Implementation Method 2
at least one recess which passes through the wavelength conversion film in a region corresponding to a gap between the adjacent light emitting devices
Implementation Method 3
a reflective member which surrounds the side surfaces of the light emitting devices along an edge of the wavelength conversion film
Data Source
AI summary
Embodiments of the present invention relate to a light emitting device package having uniform color characteristics, wherein the light emitting device package includes: a substrate including first and second lead frames; at least two light emitting devices disposed on the substrate and electrically connected to the first and second lead frames; an integrated wavelength conversion film disposed on the at least two light emitting devices and including a first region which overlaps the light emitting devices and a second region other than the first region; at least one recess which passes through the wavelength conversion film in a region corresponding to a gap between the adjacent light emitting devices; and a lens disposed on the substrate to cover the light emitting devices and the first and second lead frames.