Inter-Module Cooling Unit for Semiconductor Memory Heat Dissipation
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Solution Overview
Problem
Conventional memory packages face challenges in dissipating heat efficiently, particularly when memory device density and processing speed increase, leading to excessive heat generation that can exceed maximum operating temperatures without sufficient cooling.
Innovation Solution
The implementation of a heat dissipation assembly using a thermally conductive body with phase transition components and cooling units that fit between adjacent memory modules, allowing for efficient heat transfer without the need for airflow, enabling reduced spacing between modules and increased density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If memory device density and processing speed are increased, then memory performance and capacity are improved, but heat generation increases causing operating temperatures to exceed maximum limits
Solution Approach 1:
The cooling solution transitions from planar cooling (within the plane of the memory module) to three-dimensional cooling by utilizing the vertical gap between adjacent memory modules. Cooling units are positioned in the间隙 between modules to dissipate heat from multiple sides, effectively using the third dimension (vertical spacing) to enhance heat dissipation capacity without increasing the footprint area.
Solution Approach 2:
Cooling units act as intermediary components positioned between adjacent memory modules to facilitate heat transfer. These cooling units serve as thermal mediators that conduct heat away from the memory devices through their thermally conductive materials, enabling efficient heat dissipation without direct modification to the memory devices themselves.
2Temperature
If conventional cooling methods are used, then heat dissipation is achieved, but airflow requirements increase spacing between modules reducing density
Solution Approach 1:
The invention replaces the mechanical airflow-based cooling system with a solid-state thermal conduction system. Instead of relying on air flow mechanisms (fans, vents, channels) that require significant spacing, the solution uses thermally conductive materials and phase change materials that passively conduct heat away from memory devices through direct thermal contact, eliminating the need for airflow and associated spacing requirements.
Solution Approach 2:
Phase change materials are incorporated into the cooling units to enhance heat dissipation efficiency. These materials absorb and dissipate heat through phase transitions (such as solid-liquid transitions), providing high heat capacity and efficient thermal management without requiring airflow or increasing module spacing.
3Quantity of substance
If module spacing is reduced to increase density, then memory module density is improved, but heat dissipation becomes insufficient causing temperature to rise
Solution Approach 1:
The cooling approach shifts from two-dimensional planar cooling to three-dimensional cooling by utilizing the vertical gap between modules. Cooling units extend into the gap space to contact multiple memory devices from different sides, effectively using the third dimension to increase heat dissipation surface area without increasing the horizontal footprint or requiring additional spacing between modules.
Solution Approach 2:
Cooling units are nested within the gap structure between adjacent memory modules, with cooling components positioned to simultaneously cool multiple modules. This nested arrangement allows the cooling system to be integrated into the existing module spacing without requiring additional space, enabling efficient heat dissipation while maintaining high module density.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively dissipates heat from memory devices with reduced spacing between modules, maintaining operating temperatures within a safe range without requiring airflow, thus enabling higher memory module density and improved performance.
Implementation Method 1
The cooling unit can include a phase transition component disposed in the cavity of the cooling unit. The phase transition component can be configured to transfer heat from the interior of the cooling unit to the base portion.
Implementation Method 2
The base portion can be configured to transfer heat to a surrounding environment via at least one of conduction or convection.
Implementation Method 3
The base portion can be configured to transfer heat to a surrounding environment via at least one of conduction or convection.
Data Source
AI summary
A semiconductor memory system having a plurality of semiconductor memory modules that are spaced apart from each other by a gap. The system includes a heat dissipation assembly having a thermally conductive base portion configured to transfer heat away from the memory devices. The heat dissipation assembly including at least one cooling unit extending from the base portion. The at least one cooling unit having a wall with an exterior surface and a cavity. The cooling unit is configured to fit in the gap between adjacent memory modules such that a portion of the exterior surface on a first side of the cooling unit is coupled to one of the first memory devices and another portion of the exterior surface on a second side of the cooling unit is coupled to one of the second memory devices across the gap.