Interactive Display Pixel Layout With LED, VCSEL, and IR Detection
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Solution Overview
Problem
Existing image display devices lack an effective combination of light emission and optical capture functions, particularly for interactive applications requiring both visible light emission and infrared detection, which limits their functionality in environments like movement detection and facial recognition.
Innovation Solution
The development of an interactive image display device comprising a substrate with monolithic elementary chips, each containing LEDs and integrated control circuits, along with laser diodes and photosensitive detectors, including organic or inorganic photodiodes, arranged in a matrix configuration to enable both light emission and detection capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the device incorporates both LED and laser diode functions, then the versatility and adaptability of the display device is improved, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent combines LED chips and laser diode chips into a single integrated display device structure. The LED chip includes an LED emitting visible light and a photodetector for detecting light, while the laser diode chip includes a laser diode emitting infrared light and a corresponding photodetector. Both chip types are mounted on the same substrate and controlled by integrated control circuits, merging multiple functions into one unified device.
Solution Approach 2:
The display device is designed to perform multiple functions simultaneously: visible light emission for display purposes, infrared light emission for detection applications, and light detection through integrated photodetectors. This multi-functional design allows the same device to serve both display and sensing purposes, enhancing versatility without requiring separate dedicated devices.
2Ease of manufacture
If separate chips are used for LED and laser diode functions, then the manufacturing flexibility is improved, but the device complexity and space requirements increase
Solution Approach 1:
The device is divided into distinct functional modules: LED chips for visible light emission, laser diode chips for infrared emission, and photodetector chips for light detection. Each chip type is independently manufactured and then mounted on the substrate in specific arrangements, allowing modular manufacturing while optimizing space utilization through systematic placement.
Solution Approach 2:
The patent utilizes vertical stacking and layered arrangement of chips on the substrate. Control circuits are positioned on the rear side of chips, while light-emitting and light-detecting elements are arranged on the front surface. This three-dimensional spatial organization reduces the horizontal footprint of the device while maintaining all necessary functional components.
3Measurement precision
If integrated control circuits are added to each chip, then the control precision and functionality are improved, but the manufacturing complexity and cost increase
Solution Approach 1:
Each chip is equipped with its own integrated control circuit that autonomously manages the chip's specific functions. The control circuits on the rear side of chips directly control the light-emitting elements and photodetectors on the front side, enabling independent operation and precise control of each chip without requiring complex external control systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the device to effectively emit visible light and detect infrared radiation, enhancing its suitability for interactive applications such as movement detection and facial recognition by integrating light emission and optical capture functions within a single platform.
Implementation Method 1
Each chip comprises one or more light-emitting diodes (LEDs)
Implementation Method 2
a second elementary chip comprising a vertical cavity laser diode emitting through the surface
Implementation Method 3
a plurality of photosensitive detectors, and, associated with each photosensitive detector, an integrated electronic circuit for reading the photosensitive detector
Data Source
Figure 1A~1B
Figure 1C~1F
Figure 1G~1J
AI summary
The present description relates to a device comprising: - a carrier substrate (200) having electrical connection elements; - a plurality of first monolithic elementary chips (153) fixed and electrically connected to the carrier substrate (200), each first elementary chip (153) having at least one LED and an integrated electronic control circuit for said at least one LED, the device further comprising, associated with at least one of the first elementary chips (153), a second elementary chip (223) comprising a vertical cavity laser diode emitting from the surface, fixed and electrically connected to the carrier substrate (200), the first elementary chip (153) having an integrated electronic control circuit for said laser diode.