Inter-board Connection Structure for Impedance Matching
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Solution Overview
Problem
Conventional inter-board connection structures require larger signal line conductors to achieve necessary ground capacitance for impedance matching, leading to larger impedance matching circuits.
Innovation Solution
The proposed inter-board connection structure includes a plate-shaped ground conductor in the inner layer of a dielectric board, a signal pad, a ground pad, and signal line conductors that form capacitive components between the signal pad and the signal line conductors, allowing for reduced signal line conductor size while maintaining necessary capacitance through capacitive components, eliminating the need for punched holes in the ground conductor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the size of signal line conductor is increased to provide ground capacitance for impedance matching, then the impedance matching performance is improved, but the size of impedance matching circuit becomes larger
Solution Approach 1:
The patent utilizes the space dimension by forming a capacitive component between the signal pad and the second signal line conductor that extends in the direction from the first signal line conductor to the first signal pad. This three-dimensional capacitive coupling structure provides the necessary ground capacitance without increasing the planar area of the circuit, thereby resolving the contradiction between impedance matching performance and circuit size.
Solution Approach 2:
The patent changes the electrical parameters by forming a capacitive component with specific capacitance value between the signal pad and the second signal line conductor. By adjusting the geometry and positioning of these conductors, the capacitance parameter is optimized to achieve proper impedance matching without requiring larger conductor sizes, thus improving impedance matching performance while maintaining compact circuit dimensions.
2Reliability
If punched hole is made in ground conductor to reduce parasitic capacitance, then high frequency characteristics are improved, but coupling with inner layer wire occurs making inter-board connection impossible
Solution Approach 1:
The patent introduces an intermediary capacitive component formed between the signal pad and the second signal line conductor. This capacitive structure acts as a mediator that provides the necessary electrical characteristics for high frequency operation without requiring physical modification (punched holes) of the ground conductor, thereby maintaining both high frequency characteristics and inter-board connection capability.
Solution Approach 2:
The patent applies local quality by creating a specific capacitive coupling structure only in the region between the signal pad and the second signal line conductor, while leaving the ground conductor intact. This localized approach provides the necessary electrical characteristics without compromising the overall ground conductor structure, thus avoiding coupling issues with inner layer wires while maintaining high frequency performance.
3Area of stationary object
If the third signal line conductor is made small to downsize impedance matching circuit, then circuit size is reduced, but the capacitance needed for impedance matching may be insufficient
Solution Approach 1:
The patent compensates for the reduced size of the third signal line conductor by utilizing the space dimension through the capacitive component formed between the signal pad and the second signal line conductor. This vertical/electrical field-based capacitance provides the necessary impedance matching capability without requiring larger planar dimensions of the third signal line conductor, thus enabling circuit downsizing while maintaining adequate capacitance.
Solution Approach 2:
The patent changes the electrical parameter approach by forming a dedicated capacitive component with optimized capacitance value between the signal pad and the second signal line conductor. This allows the third signal line conductor to be made smaller while the overall impedance matching capacitance requirement is met through the engineered capacitive coupling, thereby reducing circuit size without sacrificing impedance matching performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables the downsizing of impedance matching circuits while ensuring the required capacitance for impedance matching, maintaining performance without increasing the circuit size.
Implementation Method 1
a second signal line conductor extending in a direction from the first signal line conductor to the first signal pad, and forming a capacitive component between the second signal line conductor and the first signal pad
Data Source
AI summary
Disclosed is an inter-board connection structure including a signal line conductor (22) provided in an outer layer of a printed circuit board (100), a signal line conductor (24) extending in a direction from the signal line conductor (22) to a signal pad (21), and forming a capacitive component between itself and a signal pad (21), and a signal line conductor (23) branching and extending from a connecting portion between the signal line conductor (22) and the signal line conductor (24), and electrically connected to the signal pad (21).