Non-Contact Interconnect Circuit Testing via Electric Field Detection
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Solution Overview
Problem
The high integration and complexity of silicon interconnect circuit boards make defect detection inefficient and costly due to the large number of interconnects, and conventional contact-type testing methods damage the circuit and are time-consuming.
Innovation Solution
An interconnect circuit testing apparatus that generates an electric signal between two electrodes on the circuit board, creating an electric field detectable by a sensor, allowing for non-destructive testing of the circuit's integrity without direct contact, enabling efficient detection of defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional contact-type testing methods are used to detect defects in interconnect circuits, then measurement precision can be achieved, but the circuit is damaged and testing time increases
Solution Approach 1:
The patent replaces the mechanical contact-type testing system with a non-contact electric field-based testing system. Instead of using physical probes to contact the interconnect circuits, the invention applies electric signals through electrodes to generate electric fields that interact with the circuits, allowing defect detection without mechanical contact and thus preventing circuit damage
Solution Approach 2:
The patent introduces electric fields as an intermediary between the testing apparatus and the interconnect circuits. The electric field serves as a mediator that transfers testing information without requiring direct physical contact, enabling non-destructive measurement while maintaining circuit integrity
2Measurement precision
If conventional contact-type testing methods are used on highly integrated circuit boards with many interconnects, then defect detection can be performed, but productivity decreases and costs increase
Solution Approach 1:
The patent segments the testing process into two independent stages: first applying electric signals through electrodes to generate electric fields, then detecting the fields using sensors. This segmentation allows parallel processing and eliminates the need for sequential contact measurements of each interconnect, significantly improving testing efficiency for highly integrated circuits
Solution Approach 2:
By replacing mechanical contact testing with electric field generation and detection, the system can simultaneously test multiple interconnects without the time-consuming sequential probing required by conventional methods, thereby increasing productivity
3Measurement precision
If conventional contact-type testing methods are used, then interconnect circuit defects can be detected, but the complexity of the testing apparatus increases due to the large number of probes required
Solution Approach 1:
The patent makes the electrodes universal by designing them to apply electric signals across multiple interconnect circuits simultaneously. Instead of requiring individual probes for each interconnect, the same electrode structure serves multiple testing functions, reducing apparatus complexity while maintaining detection capability
Solution Approach 2:
The invention replaces the complex mechanical probe array required for contact testing with a simpler electric field generation and detection system using electrodes and sensors, significantly reducing the structural complexity of the testing apparatus
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus allows for rapid, non-destructive testing of interconnect circuits, reducing costs and improving efficiency by detecting defects without damaging the circuit, and can operate regardless of insulating layers, thus overcoming the limitations of conventional methods.
Implementation Method 1
an electric field is emitted from the interconnect circuit board in response to a potential difference between the first and second electrodes
Data Source
AI summary
An interconnect circuit testing apparatus including: an electric signal generating circuit for generating an electric signal; a first electrode arranged at a first region of a substrate, wherein the substrate includes an interconnect circuit, an upper surface and a lower surface; a second electrode arranged at a second region of the substrate; and a sensor for detecting an electric field emitted from the first region or the second region when the electric signal is applied to the substrate through the first electrode and the second electrode.