Optically Investigating Flaws/Contamination TRIZ Cases

Segmented optical imaging calculates minimum bore diameters from multiple angles, identifying effective values that account for occlusions and angle variations.

A dual illumination setup directs radiation parallel to the wafer plane, resolving fuzzy images from front-side inspection.

Alternating red, blue, and green LED segments around a central axis resolve the trade-off between multi-color versatility and light distribution uniformity.

A UV light emitting unit stimulates photoluminescence in polymer containers while a camera captures emitted blue light patterns to identify surface flaws.

An optical evaluation method collects reflected light from a photomask blank to estimate actual defect width using intensity distribution profiles.

An optical device maps defect locations within a work cell, resolving translation errors between detection and repair zones.

Spectroscopic x-ray detection determines material thicknesses to identify plastic shards despite varying belt conditions.

Selective modeling extracts underlayer spectral response to determine top layer parameters, reducing calculation overhead and complexity.

An integrated optical power meter combines a microscope camera module and detection unit to examine fiber contact end faces.

Alternating dark and light stripes on a compressible frame generate high-contrast reflection patterns that reveal subtle dents and waves in vehicle bodies.

Pulse enable circuit controls emission timing to resolve luminance jitter and non-uniformity in LPP-EUV mask inspection.

A dark-field confocal microscopy apparatus generates two fractional vortex beams to scan samples and obtain distinct signal return lights.

A pinhole lens optical system directs light rays through front and rear groups to focus images on a sensor.

Multi-wavelength radiation imaging differentiates ophthalmic lens defects from bubbles using sequential visible and infrared captures.

Differential detectors capture reflected light intensity variations to determine semiconductor wafer surface height.

Splitting radiation into measurement and reference beams rejects stray radiation, restoring optical measurement accuracy.

A patterned test photomask generates distinct EUV light intensities for in-situ calibration of time-delay-integration sensors.

A back-illuminated image sensor uses a pure boron layer on the semiconductor membrane to enhance photon penetration and reduce surface defects.

A medical container inspection kit concentrates light through the article edge to enhance defect contrast.

A front objective produces a diffraction-limited intermediate image for a three-spherical mirror relay delivering the projection to a fixed plane.

An optical sensor device assesses electrode tip reflectivity and shape using an integrated reflection system.

A terahertz emitter and detector system analyzes reflected energy to identify surface features through protective layers.

Series imaging units generate annular beam images to resolve the trade-off between high-speed scanning and comprehensive defect detection coverage.

Replacing X-ray imaging with optical photography and automated pixel analysis resolves the trade-off between image capture rate and measurement precision.

A surface optical inspector uses a time-varying beam reflector and telecentric scan lens to direct radiation toward detectors.

Three light sources illuminate tires for a linear camera to detect defects, reducing system complexity and operating costs.

A moving object inspection method uses virtual device models to differentiate between object and equipment abnormalities during automated testing.

A laser sensor detects intensity changes from surface particles on a modulator to determine precise X-Y coordinates.

Confocal optical systems segment bright-field and dark-field data to resolve noise-induced precision trade-offs in sub-100 nm defect detection.

Infrared cameras detect thermal radiation from parisons to identify foreign matter, resolving opacity constraints that block optical sensors.

Merging inspection steps reduces queue times and contamination risk while maintaining defect detection accuracy.

A movable stage positions a mirror to reflect component images to a fixed optical sensor.

A multi-color sensor captures simultaneously emitted phase-shifted spatial intensity patterns from a specimen surface using a single wavelength-multiplexed image.

Adjusts inspection criteria using supplier quality history data to resolve inconsistencies in manual decision-making while maintaining operational flexibility.

Segmented ejection arms remove defective preforms without interrupting continuous transport speed.

Dynamic sensor alignment maintains optimal distance and angle during measurement, resolving precision limits in existing capacitive techniques.

A parison inspection device uses transverse conveying and optical detection units to capture images of preforms during transfer.

Laser excitation creates detectable carrier signals to identify defect types without mechanical damage or complex contact procedures.

Adjustable LED lighting device maintains uniform illumination across wide industrial vision zones.

Curved test fixture bends fuse assemblies to a designated angle, preventing manual damage during catheter joint inspection.

An interconnect circuit testing apparatus uses electrodes to generate electric fields for non-destructive defect detection.

An anisotropic diffusion sheet directs light to reduce shadows during textile material monitoring.

A graphene-dielectric-semiconductor plasma discharge device generates broadband ultraviolet radiation through field emission and magnetic confinement.

A lens and filtering means divide inspection light into solid angle regions with specific optical attributes for uniform irradiation.

Multi-color illumination detects curl asperities via reflected light, eliminating false positives from color figures to improve yield.

A rotating container inspection system acquires image series at controlled angular speeds to identify defective areas on transparent vessels.

Automated photometer measures cuvette absorbance to assign integrity status, eliminating manual calibration downtime.

Offset grid arrays generate high-speed pixel clocks, resolving signal contrast deterioration at low diffraction grating pitches.

Radial spot arrangement eliminates pitch errors from uneven spacing, maintaining sensitivity and throughput across the wafer.

An oblique illumination defect inspection system employs an adjustable aperture unit to block specular reflection while optimizing detection conditions.