Interconnect Structure for Multi-Configuration Semiconductor Packages
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Solution Overview
Problem
The existing technologies face challenges in efficiently connecting different package configurations in semiconductor structures, leading to the need for multiple connection designs and costly redesigns for various configurations, such as 2D, 2.5D, and 3D, which complicates module assembly and increases manufacturing costs.
Innovation Solution
A single interconnect structure comprising a conductive grid pattern and a control circuit with programmable fuses allows for electrical connections to multiple package configurations, enabling a unified design that can be adapted through a fuse blowing process to connect with various configurations like TSV and micropillar I/Os, eliminating the need for separate designs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a single connection design is used for a single package configuration, then the connection is optimized for that specific configuration, but many different connection designs are required for many different package configurations, making assembly difficult and increasing costs
Solution Approach 1:
The interconnect structure is designed with a universal grid pattern of conductive columns and levels that can accommodate multiple package configurations (2D, 2.5D, 3D, TSV, micropillar) through a single unified design, eliminating the need for configuration-specific connection designs
Solution Approach 2:
The control circuit dynamically configures the interconnect structure by selectively activating or deactivating specific conductive paths based on the detected package configuration type, allowing the same physical structure to adapt to different configurations through electrical control
2Reliability
If separate connection designs are created for each package configuration, then each design is optimized for its specific configuration, but redesign costs and manufacturing complexity increase significantly
Solution Approach 1:
A single universal interconnect design replaces multiple configuration-specific designs, maintaining connection reliability through optimized conductive patterns while eliminating redundant design and manufacturing processes for different package configurations
Solution Approach 2:
The control circuit changes electrical parameters (conductivity, resistance, signal routing) based on the package configuration type to maintain optimal connection performance across different configurations without physical redesign
3Adaptability or versatility
If multiple connection designs are used for different package configurations, then each configuration can be properly connected, but the assembly process becomes very difficult and time-consuming
Solution Approach 1:
The universal interconnect structure accepts multiple package configuration types through a single standardized interface, dramatically simplifying the assembly process by eliminating the need to select or switch between different connection designs during module assembly
Data Source
AI summary
The present disclosure relates to semiconductor structures and, more particularly, to an interconnect structure to connect between different package configurations and methods of manufacture. The structure includes an interconnect comprising a plurality of conductive levels and columns configured into a grid pattern within an insulator material, the plurality of conductive levels and columns aligned to connect to different package configurations; and a control circuit that provides a signal to the interconnect to connect to a combination of the different package configurations.