Interconnect Reliability Testing via Voltage Drop Analysis
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Solution Overview
Problem
Existing methods for testing the reliability of interconnects in IC packages require specially configured daisy-chained devices, which is inefficient and may not detect subtle failures, and existing diagnostic techniques like X-raying can only detect physical damage, failing to identify all potential issues.
Innovation Solution
A method using a standard functional IC package without daisy-chain or special testing hardware, where a reference voltage is applied to contacts in the power and ground nets, and the voltage drops are measured to assess reliability, utilizing a Quad Voltage Comparator and Field Programmable Gate Array (FPGA) to determine pass/fail status and locate defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If daisy-chained devices with special testing hardware are used, then interconnect reliability can be tested, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent extracts the testing function from specialized daisy-chained devices and implements it using standard functional IC packages. By removing the need for special testing hardware and using only standard devices, the complexity is reduced while maintaining the ability to test interconnect reliability through voltage drop measurements across power and ground nets.
Solution Approach 2:
The patent makes standard functional IC packages serve dual purposes: both their normal operational function and interconnect reliability testing. The standard IC packages with power and ground nets are used for testing instead of requiring separate specialized testing devices, thereby reducing overall system complexity while maintaining testing capability.
2Productivity
If statistical sampling is used for reliability testing, then testing time is reduced, but detection precision of subtle failures decreases
Solution Approach 1:
The patent replaces statistical sampling methods with direct electrical measurement using voltage drop analysis. By measuring actual voltage drops across power and ground nets using standard functional IC packages, the system can detect subtle failures deterministically rather than relying on statistical probability, thereby improving detection precision without significantly increasing testing time.
3Difficulty of detecting and measuring
If X-raying is used for diagnostic purposes, then physical damage can be detected, but subtle electrical failures remain undetected
Solution Approach 1:
The patent substitutes physical diagnostic methods like X-raying with electrical measurement methods. By applying voltage signals and measuring voltage drops across power and ground nets, the system detects electrical failures and subtle defects that X-raying cannot perceive, while still being able to identify physical damage through its effect on electrical characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for reliable testing of interconnects without special hardware, detecting subtle defects and providing detailed data on defect locations, improving the accuracy and efficiency of IC package reliability verification.
Implementation Method 1
The voltage drops at the contacts in the power and ground nets are measured and compared to a threshold voltage level
Data Source
AI summary
In one embodiment, the reliability of the L2 power and/or ground sub-arrays of contacts of a functional integrated circuit device is verified by applying a reference voltage to a selected contact in sub-array and sequentially measuring the voltage at other contacts in the sub-array. If the voltage levels are greater than a threshold voltage level then the functional integrated circuit device is verified as being reliable.