Interconnect Substrate with Embedded Inorganic Portions for Gas Venting
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Solution Overview
Problem
In the manufacturing of interconnect substrates, the vaporization of moisture and volatile components in organic material-based insulating layers leads to gas accumulation, causing expansion issues due to the lack of an escape path, and existing technologies face challenges in securing adhesion between insulating and interconnect layers.
Innovation Solution
The interconnect substrate design includes an organic resin layer with embedded inorganic oxide, nitride, or oxynitride portions exposed at its surface, allowing gas escape and enhancing adhesion through an interconnect layer that contacts both the resin and embedded portions, ensuring secure adhesion and a path for gas release.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If an inorganic insulating intermediate layer is formed over the entire upper surface of the insulating layer to improve adhesion, then adhesion to the interconnect layer is secured, but gas escape path is blocked causing gas accumulation and expansion
Solution Approach 1:
The insulating intermediate layer is selectively formed only in regions where interconnect layers are to be formed, rather than covering the entire upper surface. This local formation approach maintains adhesion strength in necessary areas while leaving other areas open for gas escape paths, thereby resolving the contradiction between adhesion and gas venting.
2Strength
If the insulating intermediate layer is formed to secure adhesion, then bonding strength is improved, but device complexity increases due to additional manufacturing steps
Solution Approach 1:
The insulating intermediate layer is formed in advance during the insulating layer formation process itself, rather than as a separate subsequent step. This preliminary action integrates the adhesion layer creation into the existing manufacturing flow, securing adhesion while minimizing additional process complexity.
Data Source
AI summary
A interconnect substrate includes an insulating layer including an organic resin layer and a plurality of embedded portions that are embedded in the organic resin layer and exposed at an upper surface of the organic resin layer, and an interconnect layer in contact with the upper surface of the organic resin layer and an upper surface of the embedded portions, wherein the embedded portions are made of an oxide, nitride, or oxynitride of inorganic material, and wherein the upper surface of the organic resin layer is partially exposed in areas where the interconnect layer is not formed on the insulating layer.