Interdigitated Multilayer Capacitor Frame for Thermal Stability

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Solution Overview

Problem

Existing multilayer capacitors lack thermal stability, requiring separate cooling devices, which increases costs, and existing assembly processes are complex and costly, leading to instability due to elongated shapes from unidirectional stacking.

Innovation Solution

A novel electronic component design featuring a first and second frame with extension portions to interdigitate multilayer capacitors in a comb-tooth structure, allowing for parallel connection and alternating orientation to enhance stability, with a sealing part to protect and improve mounting flexibility.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If electrolytic capacitors or film capacitors are used to achieve high capacitance and high voltage resistance, then thermal stability is poor requiring separate cooling devices, but using thermally stable multilayer capacitors increases the cost of the multilayer capacitor itself

Engineering Contradiction:
Improvethermal stabilityVSAvoidcost of multilayer capacitor
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The product is segmented into multiple individual multilayer capacitors that are stacked together, allowing each capacitor to maintain its own thermal characteristics while collectively achieving the desired performance. This segmentation enables the use of thermally stable multilayer capacitors without requiring a single large expensive component.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Multiple multilayer capacitors are merged into a single stacked structure, combining their individual thermal stability advantages while achieving high capacitance and voltage resistance collectively. This merging eliminates the need for separate cooling devices while maintaining cost-effectiveness through the use of standard multilayer capacitor components.

Inventive Principle:
Principle #5Merging (Combining)

2Reliability

If multiple multilayer capacitors are attached to each other to achieve high capacitance and thermal stability, then cooling devices can be omitted, but the assembly process becomes complex and costly

Engineering Contradiction:
Improvethermal stabilityVSAvoidassembly process
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

A frame structure is introduced as an intermediary component to simplify the assembly of multiple multilayer capacitors. The frame provides a standardized mounting platform with extension portions that facilitate easy attachment and alignment of the capacitors, reducing assembly complexity while maintaining thermal stability.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The frame structure serves multiple functions: it provides mechanical support, enables thermal management through its design, facilitates electrical connections, and simplifies the attachment process. This multi-functionality reduces the need for separate assembly components and procedures, thereby reducing overall assembly complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Ease of manufacture

If multilayer capacitors are stacked in a single direction to simplify assembly, then the product becomes entirely elongated in one direction, but this deteriorates stability

Engineering Contradiction:
Improveassembly simplicityVSAvoidproduct stability
Core Design Contradiction:
Ease of manufactureVSStability of the object's composition

Solution Approach 1:

The frame structure is designed with asymmetric extension portions that extend in multiple directions rather than a single direction. This asymmetric design allows capacitors to be arranged in a balanced configuration, improving product stability while maintaining assembly simplicity through the standardized frame interface.

Inventive Principle:
Principle #4Asymmetry

Solution Approach 2:

The capacitor stacking is extended from a single linear dimension to multiple dimensions through the frame's extension portions. This dimensional expansion allows capacitors to be arranged in a two-dimensional pattern on the frame, achieving both assembly simplicity and improved product stability through better weight and stress distribution.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS11081276B2Electronic component
Publication Date: 2021.08.03 SAMSUNG ELECTRO MECHANICS CO LTD
  • US11081276B2 patent drawing
  • US11081276B2 patent drawing
  • US11081276B2 patent drawing

AI summary

An electronic component includes: a first frame, including a first support portion and a plurality of first extension portions, extended from the first support portion in a first direction; a second frame, including a second support portion disposed to face the first support portion and a plurality of second extension portions, extended from the second support portion in a second direction opposite to the first direction and disposed to alternate with and be spaced apart from the first extension portions in the first direction; and a plurality of capacitors disposed on first and second extension portions adjacent to each other by a predetermined interval so that first and second external electrodes are adhered thereto, respectively.