Interference Thin Layer Pattern for Epitaxial Temperature Uniformity
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Solution Overview
Problem
During the epitaxial process for semiconductor device manufacturing, non-uniform temperature distribution occurs across the substrate due to intensive light overlap from heating lamps, leading to thickness deviations in the thin layer formed.
Innovation Solution
A layer deposition apparatus is designed with a process chamber having an upper and lower chamber, a substrate support, a lamp heating portion, and an interference thin layer pattern on the upper surface of the upper chamber. The interference thin layer pattern, with alternating thin layers of different refractive indices, serves as an optical filter to prevent light overlap and ensure uniform light distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heating lamps are used to heat the substrate during epitaxial process, then the substrate temperature is increased to enable thin layer formation, but non-uniform temperature distribution occurs across the substrate due to light overlap
Solution Approach 1:
A diffuser plate is introduced as an intermediary component between the heating lamps and the substrate. This diffuser plate scatters the concentrated light from the lamps, transforming the non-uniform light distribution into uniform light distribution across the substrate surface, thereby achieving uniform temperature distribution and uniform thin layer thickness
Solution Approach 2:
The patent employs a simple, cost-effective diffuser plate that can be easily replaced. The diffuser plate serves its purpose of light scattering and can be disposed of or replaced when worn or contaminated, providing an economical solution to the light distribution problem without requiring complex adjustable mechanisms
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of the interference thin layer pattern in the layer deposition apparatus achieves a uniform thin layer thickness across the substrate, addressing the issue of non-uniform temperature distribution and thickness deviations.
Implementation Method 1
an interference thin layer pattern disposed on an upper surface of the upper chamber and configured to reflect at least a portion of light from the plurality of light sources
Implementation Method 2
an interference thin layer pattern disposed on an upper surface of the upper chamber and configured to reflect at least a portion of light from the plurality of light sources
Data Source
AI summary
A layer deposition apparatus includes a process chamber configured to provides a space for processing a substrate, the process chamber including an upper chamber and a lower chamber that define an inner space; a substrate support disposed within the process chamber and configured to support the substrate; a lamp heating portion disposed above the upper chamber outside the process chamber and including a plurality of light sources configured to irradiate light onto the substrate through the upper chamber; and an interference thin layer pattern disposed on an upper surface of the upper chamber and configured to reflect at least a portion of light from the plurality of light sources.