Interleaved LED Pick-and-Place Patterns for Uniform Substrate Performance
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing pick-and-place apparatuses for light-emitting diodes (LEDs) fail to achieve uniform performance distribution on substrates while maintaining high throughput, as non-uniformity in component performance from the carrier is transferred to the substrate during the pick-and-place process.
Innovation Solution
A pick-and-place apparatus that uses multiple interleaved placement patterns across multiple passes to distribute LEDs uniformly across the substrate, allowing each pass to start and end at the same position with specific offsets, ensuring that components are spread out over the substrate to prevent large performance differences between areas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a single placement pattern is used for high-speed pick-and-place, then throughput is improved, but uniformity of component performance distribution deteriorates
Solution Approach 1:
The placement process is segmented into multiple passes, each using a different placement pattern from the collection of interleaved patterns. This segmentation allows the system to maintain high speed while achieving uniform performance distribution by varying the placement strategy across passes.
Solution Approach 2:
The controller periodically switches between different placement patterns from the collection of interleaved patterns across multiple passes. This periodic variation in placement patterns ensures that components are distributed uniformly across the substrate while maintaining continuous high-speed operation.
2Productivity
If components are collected from carrier edge areas with worst performance, then throughput is improved, but substrate performance uniformity worsens
Solution Approach 1:
Different placement patterns are applied to different regions and passes, with patterns specifically designed to distribute components from carrier edge areas (with worst performance) across the entire substrate. This local variation in placement strategy ensures that no single region dominates the performance characteristics.
Solution Approach 2:
The solution adds the dimension of multiple passes with different patterns rather than relying solely on single-pass linear placement. By distributing components from edge areas across multiple dimensional passes, the system achieves uniform performance distribution while maintaining high throughput.
3Manufacturing precision
If multiple interleaved placement patterns are used to improve uniformity, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The pattern determination unit automatically selects and determines the appropriate placement patterns from the collection, eliminating the need for manual configuration. The system self-manages the complexity by autonomously determining which patterns to use in each pass based on the requirements for uniform performance distribution.
Solution Approach 2:
The controller varies parameters such as the specific placement pattern selected, the number of passes, and the offset positions dynamically. By changing these parameters systematically, the system achieves uniform performance distribution without requiring permanently complex hardware configurations.
4Manufacturing precision
If multiple passes with offsets are used to distribute components uniformly, then performance uniformity is improved, but processing time increases
Solution Approach 1:
The multiple passes are designed to continue the placement operation without idle time between passes. Each pass uses a different pattern from the collection, and the controller coordinates movements to ensure continuous productive action, minimizing non-value-added time while achieving uniform distribution.
Data Source
AI summary
Aspects of the present disclosure relate to a pick-and-place apparatus that is configured to cause components to be placed on a substrate in a number of passes, and during each pass, components among a plurality of components are placed on the substrate in a respective placement pattern among a collection of interleaved placement patterns.