Intermetallic Mesh Connection Structure for High-Temperature Joint Stability
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Solution Overview
Problem
Conventional electronic systems face challenges in achieving high-reliability connections between electronic components and conductive carriers, particularly due to issues such as delamination and remelting of solder connections under thermal stress.
Innovation Solution
An intermetallic connection structure is introduced, comprising a central intermetallic mesh structure and opposing exterior structures without a mesh, which forms a mechanically strong and thermally stable backbone, preventing delamination and remelting by embedding a network of different metals in a solder matrix.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional solder connection is used to connect the carrier and component, then the connection is easy to manufacture, but the connection structure lacks mechanical strength and stability at high temperatures leading to delamination and remelting
Solution Approach 1:
The connection structure is segmented into three distinct zones: a first exterior structure adjacent to the carrier, a central intermetallic mesh structure, and a second exterior structure adjacent to the component. This segmentation allows each zone to perform specific functions - the exterior structures provide smooth transitions and stress distribution, while the central mesh provides high-temperature stability and mechanical strength, resolving the contradiction between reliability and complexity.
Solution Approach 2:
Different regions of the connection structure have different material compositions and microstructures tailored to local requirements. The exterior structures have a gradient composition for stress distribution, while the central mesh has a fine interconnected network for high-temperature stability. This local quality optimization enables the overall structure to achieve high reliability without excessive complexity.
2Stability of the object's composition
If the intermetallic connection structure uses a continuous intermetallic mesh throughout, then high temperature stability is improved, but the transition between carrier/component and intermetallic mesh becomes abrupt causing stress concentration
Solution Approach 1:
The connection structure transitions from exterior structures with gradient composition to the central intermetallic mesh, creating smooth material transitions that distribute stress evenly. The exterior structures act as buffer zones that gradually transition properties, preventing abrupt interfaces and stress concentration points while maintaining high-temperature stability through the central mesh.
Solution Approach 2:
The exterior structures serve as intermediary zones between the carrier/component and the central intermetallic mesh. These intermediary layers provide gradual property transitions and stress distribution, mediating the interface between dissimilar materials to prevent stress concentration while maintaining the high-temperature stability provided by the central mesh.
3Object-affected harmful factors
If lead-free intermetallic materials are used, then environmental friendliness is improved, but the manufacturing precision and control of connection properties become more difficult
Solution Approach 1:
The patent optimizes parameters such as particle size distribution, volume fractions, and thermal processing conditions to achieve reliable lead-free intermetallic connections. By carefully controlling these parameters during manufacturing, the connection properties can be precisely controlled despite using environmentally friendly lead-free materials, resolving the contradiction between environmental impact and manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The intermetallic connection structure provides a highly reliable mechanical and electrical connection capable of withstanding high thermal and mechanical loads without cracks or separation, ensuring a stable connection even at elevated temperatures.
Implementation Method 1
an intermetallic connection structure connecting the carrier and the component and comprising an intermetallic mesh structure in a central portion of the intermetallic connection structure
Implementation Method 2
a solder-type intermetallic connection using a solder matrix with intermetallic phase promoter and acceleration particles
Implementation Method 3
intermetallic phase promoter and acceleration particles, ensuring a reliable mechanical and electrical link
Data Source
AI summary
An electronic system is disclosed. In one example, the electronic system comprises an at least partially electrically conductive carrier, an electronic component, and an intermetallic connection structure connecting the carrier and the component. The intermetallic connection structure comprising an intermetallic mesh structure in a central portion of the intermetallic connection structure, and opposing exterior structures without intermetallic mesh and each arranged between the intermetallic mesh structure and the carrier or the component.