Internal Power Supply Protective Element for Semiconductor ESD Protection

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Solution Overview

Problem

Semiconductor devices with miniaturized elements are prone to electrostatic discharge (ESD) breakdown due to insufficient protection from surge currents, as existing power supply protective elements are inadequately laid out and fail to provide reliable discharge paths, especially for branch lines connected to main wiring.

Innovation Solution

Incorporating an internal power supply protective element connected with a branch line in addition to the conventional power supply protective element near the terminal, providing multiple discharge paths to prevent internal circuit breakdown.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If power supply protective elements are disposed only near terminals, then the device area is minimized, but the internal circuit cannot be reliably protected from surge currents flowing through narrow branch lines

Engineering Contradiction:
ImproveESD protection capabilityVSAvoiddevice area
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The protective element arrangement is segmented into two levels: terminal-proximity protective elements for overall surge protection and internal protective elements strategically placed near vulnerable internal circuits and branch lines. This segmentation allows comprehensive protection without requiring excessive area, as each segment handles specific protection zones.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Protective elements are placed with different spatial qualities: some near terminals for general protection and others locally positioned near specific internal circuits and branch lines that require protection. This local quality approach ensures that surge currents are diverted at both the entry point and before they reach vulnerable internal components.

Inventive Principle:
Principle #3Local quality

2Productivity

If miniaturized elements are used to improve device function and performance, then the device becomes more compact, but the device becomes more susceptible to ESD breakdown

Engineering Contradiction:
Improvedevice function and performanceVSAvoidESD susceptibility
Core Design Contradiction:
ProductivityVSObject-affected harmful factors

Solution Approach 1:

Protective elements are preliminarily positioned throughout the device architecture, including both terminal regions and internal circuit regions, before ESD events occur. This preliminary action creates multiple pre-established discharge paths that are ready to immediately divert surge currents away from miniaturized elements, preventing breakdown before it can occur.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

Protective elements act as intermediary components between external surge sources and internal miniaturized circuits. By placing these intermediaries at strategic locations including near branch lines and internal circuits, surge currents are intercepted and diverted before they can reach and damage the vulnerable miniaturized elements.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Device complexity

If conventional power supply protective elements are used with standard layout, then the device complexity is minimized, but the protective function is insufficient for internal circuits connected via narrow branch lines

Engineering Contradiction:
Improveprotective element layout complexityVSAvoidinternal circuit protection
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The protective element layout is segmented into conventional terminal-proximity elements and additional internal elements. This segmentation maintains simplicity at the terminal level while adding targeted protection internally, balancing complexity and reliability without requiring complete redesign of the entire protective architecture.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively increases the ESD breakdown voltage and protects the internal circuit from surge currents by distributing the discharge paths more efficiently, minimizing the risk of breakdown and allowing for a more uniform breakdown voltage across terminals.

Implementation Method 1

a power supply protective element connected between a power supply and a ground terminal to suppress a voltage applied to the internal circuit when a surge is applied to a device

Methodology Applied
Scientific EffectElectrostatic Discharge: Electrostatic Discharge

Implementation Method 2

an internal power supply protective element connected with a branch line... providing multiple discharge paths to prevent internal circuit breakdown during ESD events

Methodology Applied
Scientific EffectElectrostatic Discharge: Electrostatic Discharge

Data Source

PatentUS7660085B2Semiconductor device
Publication Date: 2010.02.09 RENESAS ELECTRONICS CORP
  • US7660085B2 patent drawing
  • US7660085B2 patent drawing
  • US7660085B2 patent drawing

AI summary

A conventional layout of power supply protective element cannot sufficiently protect an internal circuit against a surge current that flows into a narrow branch line that branches off from a thick main wiring line. A semiconductor device according to an embodiment of the present invention includes a power supply protective element connected around a terminal; a main wiring line connected with a VCC pad or a GND pad; a branch line that branches off from the main wiring line and applies a power supply potential or a ground potential to a functional block of the semiconductor device; a branching portion at which the branch line branches off from the main wiring line; and an internal power supply protective element connected with the branch line.