Internal Heat-Dissipation Terminal With Cavity Storage
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Solution Overview
Problem
Conventional heat dissipation methods for electronic terminals either lead to increased overall temperature when balancing heat or are difficult to implement in limited spaces, requiring reduced performance or function cessation.
Innovation Solution
An internal heat-dissipation terminal with cavities in unused areas, utilizing heat-storage material to enhance thermal management, where the cavities are enclosed by shield frames or device brackets to isolate and insulate the heat-storage material from active components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation material is added to heating chips to accelerate outward heat transfer, then heat dissipation speed is improved, but overall terminal temperature increases to upper limit quickly
Solution Approach 1:
The terminal is divided into functional zones: heating areas (chips), heat dissipation pathways (conduction channels), and heat storage zones (cavities with heat-storage material). This segmentation allows heat to be directed away from chips through conduction channels and stored in dedicated cavity regions, preventing overall temperature from rising quickly while maintaining effective heat dissipation from heating components.
Solution Approach 2:
Heat-storage material in cavities acts as an intermediary thermal buffer between heating chips and the terminal's external environment. The material absorbs excess heat through phase change or thermal storage, mediating the heat flow to prevent temperature spikes while maintaining continuous heat dissipation capability.
2Temperature
If air-convection or liquid-convection device is added to balance heat dissipation, then heat dissipation effectiveness is improved, but terminal space requirements increase
Solution Approach 1:
The heat storage function is merged with existing terminal structures such as the battery compartment or unused internal cavities. Instead of adding separate heat dissipation devices that occupy space, the invention utilizes available void spaces within the terminal housing to store heat-storage material, combining structural and thermal management functions.
Solution Approach 2:
The invention uses thin conduction channels and flexible thermal pathways that can be integrated into existing terminal structures without requiring bulky convection devices. The heat-storage material is contained within thin-walled cavities that minimize space occupation while maximizing thermal storage capacity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Substantially enhances heat storage capability, allowing for prolonged high-performance operation without reducing terminal speed or disabling functions, by effectively utilizing idle space for heat absorption and storage.
Implementation Method 1
heat-storage material arranged in the cavity
Implementation Method 2
heat-storage material arranged in the cavity
Implementation Method 3
the heat-storage material arranged in the cavity is insulated heat-storage material and/or non-insulated heat-storage material
Data Source
AI summary
The disclosure provides an internal heat-dissipation terminal, wherein the terminal comprises at least one cavity in which heat-storage material is arranged. The cavity is located in an area without a device in the terminal. The technical solution of the disclosure can be applied to substantially enhance the heat storage capability of the terminal.