Interposer Bevel-Cut Packaging to Prevent Cracking and Delamination
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Solution Overview
Problem
The reliability of multi-die semiconductor packages is compromised due to challenges in packaging materials and arrangements, leading to issues with thermal and physical stresses, as well as electrical connectivity, which affects the overall performance and longevity of the packaged products.
Innovation Solution
A manufacturing method involving a carrier with an interposer, semiconductor dies, conductive vias, and a redistribution structure, where a molding compound encapsulates the dies, and a bevel-cutting process forms slanted cut lanes in the interposer to prevent corner cracking and delamination, accompanied by a protection layer to reinforce connectors and reduce thermal stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional packaging materials and arrangements are used for multi-die packages, then manufacturing simplicity is maintained, but reliability deteriorates due to thermal and physical stresses causing cracking and delamination
Solution Approach 1:
The interposer is segmented with cut lanes formed therein, dividing the rigid interposer structure into sections that can move independently. This segmentation allows the packaging structure to accommodate thermal expansion and contraction without generating excessive stress, thereby preventing cracking and delamination while maintaining manufacturing feasibility through standardized processing steps.
Solution Approach 2:
The patent changes the physical parameters of the packaging structure by introducing compliance features (cut lanes) that modify the mechanical properties of the interposer. These parameter changes enable the structure to dynamically respond to thermal and physical stresses, improving reliability without requiring entirely new materials or complex assembly processes.
2Reliability
If rigid packaging structures are used, then manufacturing precision is easier to achieve, but reliability worsens due to corner cracking and delamination under thermal stress
Solution Approach 1:
Cut lanes are formed in the interposer before the singulation process, performing the stress-relief modification in advance. This preliminary action ensures that the compliance features are already in place to handle subsequent thermal and mechanical stresses during packaging and operation, preventing corner cracking and delamination while allowing standard singulation processes to be used.
3Reliability
If protective measures are added to prevent cracking and delamination, then reliability improves, but device complexity increases
Solution Approach 1:
The cut lane formation process is merged with the existing singulation process flow, combining multiple functions into a unified manufacturing sequence. By integrating the compliance feature creation into standard processing steps rather than adding separate protective measures, the patent improves reliability while minimizing increases in manufacturing process complexity.
Data Source
AI summary
A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least one semiconductor die, an interposer, an encapsulant, a protection layer and connectors. The interposer has a first surface, a second surface opposite to the first surface and sidewalls connecting the first and second surfaces. The semiconductor die is disposed on the first surface of interposer and electrically connected with the interposer. The encapsulant is disposed over the interposer and laterally encapsulating the at least one semiconductor die. The connectors are disposed on the second surface of the interposer and electrically connected with the at least one semiconductor die through the interposer. The protection layer is disposed on the second surface of the interposer and surrounding the connectors. The sidewalls of the interposer include slanted sidewalls connected to the second surface, and the protection layer is in contact with the slant sidewalls of the interposer.