Interposer Substrate Bonding Connection Line Embedding
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Solution Overview
Problem
Current methods for manufacturing display devices using interposer substrates are challenging due to the difficulty in forming bonding pads without damaging the display device, which complicates the process and reduces production yield and reliability.
Innovation Solution
A method involving a carrier substrate where a bonding connection line and thin-film transistor are formed sequentially, with the bonding connection line embedded in the interposer substrate, eliminating the need for separate bonding connection lines and transistors on both sides of the interposer substrate, and using a sacrificial layer for peeling off the carrier substrate to simplify the process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bonding pads are formed on the interposer substrate to connect drive circuits, then electrical connection is achieved, but the display device is damaged and production yield decreases
Solution Approach 1:
The patent segments the bonding connection function into two separate components: bonding connection lines formed on the carrier substrate before the interposer substrate, and bonding pads formed on the interposer substrate after the display device is completed. This segmentation allows the bonding connection lines to be established without damaging the display device, while the bonding pads are added later when the device is more robust.
Solution Approach 2:
The bonding connection lines are formed on the carrier substrate in advance, before the interposer substrate is attached. This preliminary action allows the connection pathways to be pre-established in a controlled environment, avoiding the need to form bonds on the fragile interposer substrate after the display device is assembled.
2Reliability
If separate bonding connection lines and transistors are formed on both sides of the interposer substrate, then electrical connection is achieved, but process complexity increases
Solution Approach 1:
The patent merges the formation of bonding connection lines with the carrier substrate process, combining multiple functions (carrier substrate fabrication, bonding connection line formation, and interposer substrate attachment) into a single integrated process flow. This reduces the number of separate steps compared to forming all components on both sides of the interposer substrate.
Solution Approach 2:
The carrier substrate serves multiple functions: it acts as a support during manufacturing, a platform for forming bonding connection lines, and a temporary holder during the attachment process. This multi-functionality eliminates the need for separate structures that would otherwise be required for each function.
3Productivity
If the carrier substrate is peeled off after forming bonding connection lines, then the interposer substrate is released, but process difficulty increases
Solution Approach 1:
A peeling layer is formed on the carrier substrate in advance, before the bonding connection lines are created. This preliminary action establishes a predetermined separation interface that enables controlled peeling later in the process, reducing the difficulty of releasing the interposer substrate.
Solution Approach 2:
The peeling layer acts as an intermediary between the carrier substrate and the bonding connection lines/interposer substrate. This intermediate layer provides a controlled interface for separation, allowing the carrier substrate to be peeled off without directly damaging the bonding connection lines or interposer substrate.
Data Source
AI summary
An array substrate and a manufacturing method thereof, a display device and a manufacturing method thereof are provided, which belong to the technical field of display. The array substrate includes: an interposer substrate, a thin-film transistor disposed on one side of the interposer substrate, and a bonding connection line embedded in the other side of the interposer substrate. The bonding connection line is configured to be connected to a drive circuit. An interposer via hole is arranged on the interposer substrate. A conductive structure is arranged in the interposer via hole. The thin-film transistor is electrically connected to the bonding connection line by the conductive structure.