Interposer Thermal Compression Bonding Without Copper Core Balls

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Solution Overview

Problem

Conventional methods for fabricating semiconductor packages using copper core balls to connect and support interposers and lower packages require separate processes, increasing the number of steps and are prone to thermal compression-induced cracks.

Innovation Solution

A semiconductor substrate bonding device with a bonding tool featuring a first and second region, including protrusion parts, is used to thermally compress and bond interposers and substrates, minimizing process steps and reducing crack formation by using a material like aluminum nitride or silicon carbide.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If copper core balls are used to connect and support the interposer and lower package, then mechanical support and electrical connection are achieved, but the number of process steps increases and cracks may occur due to thermal compression

Engineering Contradiction:

Improveconnection reliabilityVSAvoidprocess complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent removes copper core balls from the bonding process entirely. Instead of using separate copper core balls for mechanical support and electrical connection, the invention uses a simplified bonding tool that directly bonds the interposer to the substrate through thermal compression, eliminating the need for copper core balls and reducing process complexity while maintaining connection reliability

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent combines the mechanical support and electrical connection functions into a single bonding process. The bonding tool integrates both support and bonding operations, eliminating the need for separate copper core ball attachment and soldering processes, thereby reducing the number of process steps while achieving both mechanical and electrical connectivity

Inventive Principle:

Principle #5Merging (Combining)

2Reliability

If separate processes are used to attach copper core balls and solders to the interposer, then mechanical support and electrical connection are achieved, but the number of process steps increases

Engineering Contradiction:

Improveconnection reliabilityVSAvoidfabrication efficiency

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The patent merges the mechanical support and electrical connection processes into a single thermal compression bonding operation. The bonding tool is designed to perform both functions simultaneously, eliminating multiple separate processes (copper core ball attachment, soldering) and thereby improving fabrication efficiency while maintaining connection reliability

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The bonding tool is designed with multi-functionality, serving both as a mechanical support structure and as a bonding instrument. This universal tool performs multiple operations (support, bonding, compression) in a single process, reducing the total number of process steps and improving productivity

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Reliability

If thermal compression is applied to bond interposer and substrate, then bonding is achieved, but cracks may occur in copper balls

Engineering Contradiction:

Improvebonding reliabilityVSAvoidthermal damage

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent removes copper core balls from the bonding process, eliminating them as a potential source of thermal damage. By using direct thermal compression bonding between the interposer and substrate without copper balls, the invention prevents crack formation while achieving reliable bonding

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The bonding tool is designed to distribute thermal compression forces evenly across the bonding interface before actual bonding occurs. This pre-distribution of stress prevents localized overheating and crack formation, cushioning the materials against thermal damage while achieving reliable bonding

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method reduces the number of process steps and minimizes crack formation, ensuring stable and efficient electrical connections between interposers and substrates.

Implementation Method 1

solder may be bonded between the interposer and the lower package by thermal compression (TC) bonding in a thermal compression manner using a bonding tool

Methodology Applied

Scientific EffectThermal compression:

Data Source

PatentUS12616047B2Method of fabricating a semiconductor package including an interposer

Publication Date: 2026.04.28 SAMSUNG ELECTRONICS CO LTD

AI summary

A method of fabricating a semiconductor package includes disposing a preliminary semiconductor package on a stage, the preliminary semiconductor package including a substrate to which a pad part is attached, an interposer disposed on the substrate, and a semiconductor chip disposed between the substrate and the interposer. A bonding tool is disposed on the interposer. The bonding tool includes a first region and a second region outside of the first region. The second region of the bonding tool corresponds to the pad part. The interposer and the substrate are bonded to each other.