Interposer Connector Height Layout for Package Substrate Warpage
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Solution Overview
Problem
The challenge in semiconductor packaging is the warpage of package substrates during bonding to interposer wafers, which can lead to issues such as cold solder joints and solder necking, affecting the quality of the conductive connectors.
Innovation Solution
Forming conductive connectors with varying heights to accommodate the warpage of package substrates, with higher heights in regions of greater warpage and lower heights in regions of lesser warpage, to improve bonding quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If package substrates are bonded to interposer wafers using conventional uniform conductive connectors, then the bonding process is simple and fast, but warpage causes cold solder joints and solder necking that reduce connector quality
Solution Approach 1:
The patent applies local quality by varying the height of conductive connectors based on their location on the package substrate. Connectors in regions with greater warpage (typically outer regions) are formed with greater heights, while connectors in regions with lesser warpage (typically inner regions) are formed with lesser heights. This location-dependent differentiation resolves the contradiction by improving connector quality in high-warpage areas without unnecessarily complicating the overall bonding process.
Solution Approach 2:
The patent implements parameter changes by modifying the height parameter of conductive connectors according to the warpage characteristics of different substrate regions. The height parameter is adjusted based on measured or predicted warpage data, allowing the bonding process to accommodate substrate deformation and prevent defects like cold solder joints and solder necking.
2Reliability
If conductive connectors are formed with varying heights to accommodate warpage, then bonding quality improves, but the manufacturing process becomes more complex
Solution Approach 1:
The patent applies preliminary action by determining the heights of conductive connectors before the bonding process based on predicted or measured warpage characteristics. This advance planning allows the varying height configuration to be built into the connector structure prior to bonding, ensuring quality improvement without adding complexity to the actual bonding operation itself.
Data Source
AI summary
Embodiments include a device. The device includes an interposer, a package substrate, and conductive connectors bonding the package substrate to the interposer. Each of the conductive connectors have convex sidewalls. A first subset of the conductive connectors are disposed in a center of the package substrate in a top-down view. A second subset of the conductive connectors are disposed in an edge/corner of the package substrate in the top-down view. Each of the second subset of the conductive connectors have a greater height than each of the first subset of the conductive connectors.