Interposer Cooling Channel and Through Electrode Design
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Solution Overview
Problem
High-performance semiconductor chips generate excessive heat, requiring enhanced cooling efficiency to prevent malfunction and degradation.
Innovation Solution
An interposer with a substrate having a hollow cooling channel and through electrodes, where a cooling medium flows through the channel, and the electrodes are electrically connected to the semiconductor chip, allowing for efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If higher performance semiconductor chip is used, then operating speed is improved, but heat generation per unit area increases
Solution Approach 1:
The cooling channel is divided into multiple main cooling channels extending in the same direction and separated from each other. This segmentation allows the cooling medium to flow through multiple parallel paths, increasing the overall cooling capacity and effectively dissipating the increased heat generation from high-performance semiconductor chips.
Solution Approach 2:
The cooling channels are configured to extend in a direction substantially perpendicular to the heat radiation direction from the semiconductor chip. This dimensional arrangement optimizes heat dissipation by creating a three-dimensional cooling structure that efficiently intercepts and removes heat from the chip surface.
2Reliability
If multiple through electrodes are arranged for electrical connection, then electrical connectivity is improved, but substrate complexity increases
Solution Approach 1:
Multiple through electrodes are arranged in groups where several electrodes extend through the substrate and are connected to cooling channel walls. This merging approach combines electrical connection functions with thermal management functions, achieving both electrical connectivity and cooling while reducing overall structural complexity.
Solution Approach 2:
The through electrodes serve dual functions: providing electrical connection to the semiconductor chip and forming part of the cooling channel structure. This multi-functionality reduces the number of separate components needed, simplifying the substrate structure while maintaining both electrical and thermal performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The interposer design significantly improves cooling efficiency by circulating a cooling medium through main cooling channels, effectively transferring heat from the semiconductor chip to the interposer and then to the medium, thereby preventing malfunction and degradation.
Implementation Method 1
the substrate body having a hollow cooling channel therein, wherein a cooling medium flows through the cooling channel
Implementation Method 2
a plurality of main cooling channels extending in a certain direction and separated from each other; an inflow channel which is communicated with one end of the respective main cooling channels; and an outflow channel which is communicated with the other end of the respective main cooling channels
Data Source
AI summary
There is provided an interposer for cooling an electronic component. The interposer includes: a substrate body having a hollow cooling channel therein, wherein a cooling medium flows through the cooling channel, the cooling channel including: a plurality of main cooling channels extending in a certain direction and separated from each other; an inflow channel which is communicated with one end of the respective main cooling channels; and an outflow channel which is communicated with the other end of the respective main cooling channels, and a plurality of through electrode groups each comprising a plurality of through electrodes arranged in a line. Each of the though electrodes is formed through the substrate body to reach the first and second surfaces of the substrate body. The respective through electrode groups are partitioned by at least corresponding one of the main cooling channels.