Interposer Outer Sidewall EMI Shielding Design
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Solution Overview
Problem
Electronic devices face challenges in minimizing electromagnetic interference (EMI) that can deteriorate signals transmitted through conductive vias in interposers, especially due to manufacturing process-related gaps where conductive members are not disposed on the sidewalls of interposers.
Innovation Solution
The interposer structure includes a design with a conductive member on the outer sidewall from the top to the bottom surface and a non-conductive member from a specific position to the bottom surface, expanding the conductive area to suppress EMI and efficiently position conductive vias, thereby preventing signal deterioration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a conductive member is disposed on the entire outer sidewall of the interposer, then electromagnetic interference is effectively blocked, but manufacturing complexity increases due to the need for complete sidewall coverage
Solution Approach 1:
The outer sidewall is segmented into two distinct areas: a first area with a conductive member extending from the top surface to the bottom surface, and a second area with a conductive member only from the top surface to a first position. This segmentation allows selective EMI shielding where it is most needed while reducing manufacturing complexity in less critical regions.
Solution Approach 2:
Different regions of the outer sidewall are assigned different shielding qualities based on their functional requirements. The first area receives full-height conductive shielding for maximum EMI protection, while the second area receives partial-height shielding, optimizing the balance between EMI blocking effectiveness and manufacturing feasibility.
2Reliability
If the conductive member area on the outer sidewall is increased, then signal integrity is improved by blocking EMI, but the available area for other components is reduced
Solution Approach 1:
The EMI shielding function is extended from a two-dimensional surface coating to a three-dimensional structure by forming conductive members that extend vertically along the outer sidewall. This vertical dimension provides effective EMI blocking without consuming excessive horizontal area that would be unavailable for other components.
Solution Approach 2:
The interposer structure combines conductive materials for EMI shielding with non-conductive materials for structural support and insulation. This composite approach allows the conductive members to provide EMI protection while the non-conductive portions maintain structural integrity and provide space for other components.
3Ease of manufacture
If a partial conductive member configuration is used in the second area, then manufacturing complexity is reduced, but EMI blocking effectiveness is compromised
Solution Approach 1:
In the second area of the outer sidewall, a partial conductive member configuration is implemented where the conductive member extends only from the top surface to a first position rather than the full height. This partial action provides sufficient EMI blocking for less critical regions while significantly reducing manufacturing complexity and material usage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively blocks electromagnetic interference, enhancing signal integrity by increasing the conductive area and optimizing the placement of conductive vias within the interposer, thus maintaining signal quality in electronic devices.
Implementation Method 1
a first area having a conductive member formed from the top surface to the bottom surface
Data Source
AI summary
According to an embodiment, an interposer structure comprises a top surface, a bottom surface facing away from the top surface; an inner sidewall extending from the top surface to the bottom surface, and forming an inner space accommodating one or more electronic components mounted on a circuit board of an electronic device; and an outer sidewall extending from the top surface to the bottom surface, and facing away from the inner sidewall, wherein the outer sidewall includes: a first area having a conductive member formed from the top surface to the bottom surface; and a second area having a conductive member formed from the top surface to a first position and a non-conductive member formed from the first position to the bottom surface.