High Frequency Interposer Grounded Housing Impedance
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Solution Overview
Problem
Existing interposers degrade high-speed signals above 2.5 Gbps due to impedance mismatches between signal conductors and electronic assemblies, limiting their performance in high-frequency test systems.
Innovation Solution
The interposer design features a conductive housing with embedded insulators and conductive members that provide close proximity to ground, reducing impedance mismatch and crosstalk by grounding the housing, allowing for efficient signal transmission at frequencies up to 10 Gbps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional interposer designs are used, then structural simplicity is maintained, but signal integrity degrades at high frequencies above 2.5 Gbps due to impedance mismatches
Solution Approach 1:
The patent applies local quality by providing ground contacts only at specific locations adjacent to signal contacts rather than uniformly across the entire interposer. This localized grounding approach maintains impedance control where needed while reducing overall complexity. The ground contacts are strategically positioned next to signal-bearing contacts to create localized impedance-matched environments for high-frequency signals.
Solution Approach 2:
The interposer is segmented into distinct functional regions with signal contacts and ground contacts separated into different groups. This segmentation allows independent optimization of signal paths and ground references, enabling better impedance control for high-frequency signals while maintaining a manageable structural complexity through modular contact arrangements.
2Reliability
If ground contacts are placed adjacent to signal contacts, then impedance matching improves, but manufacturing precision requirements increase
Solution Approach 1:
The patent resolves alignment precision issues by transitioning from a planar two-dimensional contact layout to a three-dimensional arrangement where ground contacts are positioned in a second plane below the signal contacts. This vertical separation in the Z-dimension provides tolerance compensation, allowing broader lateral alignment tolerances while maintaining the electromagnetic coupling needed for impedance control.
Solution Approach 2:
The patent introduces an intermediary conductive structure (the second plane of ground contacts) that mediates between the signal contacts and the ultimate ground reference. This intermediate ground plane acts as a buffer that maintains impedance control even when precise alignment between signal and ground contacts is difficult to achieve during manufacturing.
3Object-affected harmful factors
If more ground contacts are added, then crosstalk reduction improves, but device complexity increases
Solution Approach 1:
The ground contact structure is segmented into two distinct planes: a first plane containing signal-bearing contacts and a second plane containing ground contacts. This segmentation allows the ground contacts to be distributed more efficiently in three-dimensional space, providing superior crosstalk cancellation through spatial diversity without requiring a proportional increase in the total number of contacts.
Solution Approach 2:
By adding the vertical dimension with a second plane of ground contacts below the signal contacts, the patent achieves enhanced crosstalk reduction through three-dimensional electromagnetic field management. This dimensional expansion provides better field containment and interference cancellation with a more efficient contact count compared to purely planar arrangements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design ensures better impedance matching and reduced signal distortion, enabling reliable high-speed signal transmission beyond 2.5 Gbps by positioning grounded conductors closer to signal conductors, improving signal integrity in test systems.
Implementation Method 1
The interposer further comprises a plurality of conductive springs. Each spring has a first contact and a second contact. Each spring is partially embedded in at least one of the plurality of insulators such that the first contact of the conductive spring is exposed from the first side of the conductive housing, and the second contact of the conductive spring is exposed from the second side of the conductive housing.
Data Source
AI summary
An interposer with a conductive housing is disclosed. Conductive members pass through insulators positioned in openings in the conductive housing. The conductive housing may be grounded, providing a closely spaced ground structure for signal conductors passing through the conductive housing and therefore providing a desirable impedance to signals carried by the conductive members. Such an interposer may be used in a test system to couple high speed signals between instruments that generate or measure test signals and devices under test.